〒980-8579 宮城県仙台市青葉区荒巻字青葉６-６-40 T-Biz203
2017
Nov 30, 2017. Conference & Exhibition
Semiconductor Packaging Symposium (MEPTEC)
~ Heterogenous integration, the road to implementation ~
Milpitas, CA
http://www.meptec.org/2017Q4/
July 14, 2017 Conference
Autotech Council
San Jose, CA
http://www.autotechcouncil.com/
2016
October 29-November 06, 2016 Conference & Exhibition
MSS/MIC 2016
(IEEE Nuclear Science Symposium & Medical Imaging Conference)
Strasburg, France
http://www.nss-mic.org/2016
Table booth
August 3 -10, 2016 Conference & Exhibition
ICHEP2016
38th International Conference on High Energy Physics
Chicago, IL
Table booth (Exhibition 8/7-10)
https://www.ichep2016.org/
July 12-14, 2016. Conference & ExhibitionSemiconWest 2015 Booth No. 733
San Francisco, CA
http://www.semiconwest.org/
May 31-June 3, 2016. Conference & Exhibition
ECTC2016 (IEEE Electronic Components and Technology Conference), Booth No.219
Las Vegas, NV
http://ectc.net/
2015
August 31-September 2, 2015. Conference
IEEE Internation 3D Integration System Conference (3DIC)
Table booth
Sendai, Japan
http://www.3dic-conf.org/
July 14-16, 2015. Conference & Exhibition
SemiconWest 2015 Booth No. 1232
San Francisco, CA
2014
Dec 10 - 12, 2014. Conference & Exhibition
3D Architectures for Semiconductor Integration and Packaging (3D ASIP)
Burlingame CA
http://www.3dasip.com/
Nov 15 - 19, 2014. Conference & Exhibition
Neuroscience 2014
Washington D.C.
http://www.sfn.org/annual-meeting/neuroscience-2014
Nov 12 - 13, 2014. Conference
T Sensors Summit for Trillion Sensor Roadmap
San Diego CA
http://www.tsensorssummit.org/
Jul 8 - 10, 2014. Conference & Exhibition
Semiconwest 2014
San Francisco CA
http://www.semiconwest.org/
2013
Dec 11 - 13, 2013. Conference & Exhibition
3D Architectures for Semiconductor Integration and Packaging (3D ASIP)
Burlingame CA
http://www.3dasip.com/
Dec 4 - 6, 2013. Exhibition
SEMICON Japan 2013 Booth No. Hall 1, D1-003
Chiba, Japan
http://www.semiconjapan.org/en/
Oct 25, 2013. Article: Solid State Technology
Title: IFTLE 166 IEEE 3DIC Conf part 1; 3DIC panel discussion; Ginti; Novati
http://electroiq.com/insights-from-leading-edge/2013/10/iftle-166-ieee-3dic-conf-part-1-3dic-panel-discussion-ginti-novati/
Oct 2 - 4, 2013 Conference & Exhibition
IEEE 3D System Integration Conference
San Francisco, CA
http://www.3dic-conf.org/
2012
Oct 13 - 17. Exhibition :
NeuroScience 2012, Booth No 1735, New Orleans LA
Oct 10. Press Release :
Strategic alliance with Microprobes for Life Sciences (Gaithersburg, MD, USA) at Multichannell Silicon Brain Probe field. More details ...
2011
Nov 13 - 16. Exhibition :
NeuroScience 2011, Booth No 2432, Washington D.C.
お問合せ・ご相談はこちら
担当：元吉
T-Micro is the unique and advanced 3D/2.5D IC process and MEMS process-oriented company, originated in Tohoku University.
As an exclusive technical representative of GINTI "Global Integration Initiative" facility, we provide worldwide customers with 3D/ 2.5D/ MEMS full foundry service as well as partial process service by use of a complete line of state-of-the-art 200 and 300mm equipment in a cost-effective and short-TAT way for R/D, prototype, and small volume production.
東北マイクロテック(T-Micro)は、最先端の積層型三次元IC(3D-IC)技術をベースにした会社で、微細TSV(貫通配線)、マイクロバンプ接合等の新技術を入れ、今後のIT需要の拡大に呼応して、従来のICチップに高性能・高機能・小型化・省電力化といった新しい機能を付加します。新規の積層型センサの開発と並行してお客様に以下のサービスを提供致します。
- 数㎜角のチップから12インチウェハレベルの加工が可能で、お客様の3D-ICやMEMSのプロトタイプ試作、部分試作サポート、材料・装置評価用サンプル試作、少量生産をサポートします。
- 半導体微細加工技術及びMEMS製造技術をベースにバイオエレクトロニックデバイスの試作をサポートします。
弊社の技術・サービス、ホームページの内容に御意見やお問い合わせがございましたら、お気軽にご連絡ください。
English Site Menu
Company
Technology
Foundry service
Service case study