We offer thin-film deposition of insulating and metal layers across diverse wafer substrates.
Our foundry services cover the full range from R&D and low-volume trials to high-volume manufacturing.
We also sell coated wafers; please inquire for specifications and availability.
| Deposition Method | Film Type | Supported Wafer Size / Notes | |
|---|---|---|---|
| Insulating Films | Thermal Oxidation | Thermal Oxide | Up to φ8 in. |
| PE-CVD(Low-Stress Deposition) | TEOS | Up to φ12 in. | |
| SiO2 | Up to φ8 in. | ||
| SiN | Up to φ12 in. | ||
| SiON | Up to φ8 in. | ||
| LP-CVD | SiO2 | Up to φ6 in. | |
| SiN | Up to φ6 in. | ||
| SiON | Up to φ6 in. | ||
| Sputtering | SiO2 | ||
| Up to φ12 in. | |||
| Metal Films | Sputtering | Ti/Cu/Cr/Ni/Al/AlCu/Ta/TaN/ TiW/TiN/AlSi/Al2O3/ (Other film types can also be considered) | Up to φ12 in. |
| LP-CVD | W | Up to φ4 in. | |
| poly-Si | Up to φ6 in. |