TSV & 3D-IC manufacturing sevices available.
Equipped with a dedicated line for wafers up to 12 inches in diameter.
We can accept contract manufacturing of TEG wafers.
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Company
Technology
Foundry service
Service case study
TSV & 3D-IC manufacturing sevices available.
Equipped with a dedicated line for wafers up to 12 inches in diameter.
We can accept contract manufacturing of TEG wafers.
Company
Technology
Foundry service
Service case study