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TSV & 3D-IC manufacturing sevices available.

Equipped with a dedicated line for wafers up to 12 inches in diameter.

For more information

 

We can accept contract manufacturing of TEG wafers.

For more information

What's new

July 27, 2026
Tohoku Microtec exhibited at CEA-Leti Innovation Days / LID World Summit 2026 in Grenoble, Flance, starting Tuesday, June 23, 2026.
July 19, 2026
Tohoku Microtec exhibited at SEMICON Southeast Asia 2026 in Kuala Lumpur, Malaysia, starting Tuesday, May5, 2026.
June 7, 2026
Tohoku Microtec will exhibit at CEA-Leti Innovation Days / LID World Summit 2026 in Grenoble, France, starting Tuesday, June 23, 2026.
May 1, 2026
Tohoku Microtec will exhibit at SEMICON Southeast Asia 2026 in Kuala Lumpur, Malaysia, starting Tuesday, May 5, 2026.
April 15, 2026
We have updated our website.
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東北マイクロテック
株式会社

住所

〒980-8579
宮城県仙台市青葉区
荒巻字青葉6-6-40 T-Biz203

当社概要・アクセスへ

Advanced 3D-Stacking IC Technology

Tohoku-Microtec Co., Ltd.

750 North King Rord #206 San Jose CA 95133 USA

Please feel free to contact us!

+81-22-398-6264

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