Contract Photolithography Processing Services

We offer contract photolithography processing services.

From single-layer patterning to multi-layer redistribution layer (RDL) build-up, we can support a wide range of requrements.

Because we can perform exposure using either a stepper or a mask aligner, please feel free to contact us to discuss any pattern needs.

Exposure Equipment Overview
Exposure Tool Supported Substrates Supported Size Key Features
i-line stepper (FPA-5500iZa)

Si / glass / SiC / SOI,
etc. (various substrates supported)

 φ8", 12"
  • Resolution performance : 1.0/1.0 µm
  • Alignment accuracy : Total |m| + 3σ ≦ 30 nm
  • Double-side alignment available
  • Resists supported : positive / negative / polyimide, etc.
  • Stepping accuracy : 3σ ≦ 30nm
  • Minimum exposure dose : 650 J/m²
  • Exposure field : 26mm × 33mm
Mask aligner Si / glass / SiC / SOI,
etc. (various substrates supported)		 Up to 12"
  • Resolution performance : N/A (depends on tool specifications)
  • Double-side alignment available           
  • Resists supported : positive / negative/ polyimide, etc.
Maskless aligner Si / glass / SiC / SOI,
etc. (various substrates supported)		 Up to 8" square
  • Resolution performance : minimum line width 0.7 µm
  • Front-side / backside alignment available
  • Resist thickness (positive)
  • Resist thickness (negative)