Tohoku-MicroTec attended Neuroscience2011 !!
Thank you so much for visiting our booth.
Nov 13 - 16, 2011
Walter E Washington Convention Center, Washington, DC
Booth: 2432
Our Mission
3D-stacked LSI is the next generation device which is expected to reduce power consumption down to half. From the view of clean environment, establishment of stable, secure and cost-effective technology of 3D stacked LSI is these days craved for. In anticipation of substitution for the current 2D LSI and promotion of the 3D-stacked LSI in a variety of market segments, further research and development are essential.
Tohoku-MicroTec Co., Ltd. (Tohoku-MicroTec), established at Sendai, Japan in April, 2010, is the unique and leading 3D-Stacked LSI process-oriented company, utilizing the next generation process & manufacturing technology, originated in Tohoku university, of fine-pitch Through-Silicon-VIA (TSV), Microbump, Thinning, Bonding and Alignment.
In 
wide and tight collaboration with New Industry Creation Hatchery Center of Tohoku University, we research and develop Bio-Electronics products for Neuroscience, provide 3D-Stacked LSI prototype manufacturing services at a drastic cost-effective way, and counsel on the development related to 3D-Stacked LSI process.
Office Opened !!
T-Microtec opened its headquarter office at T-Biz building in Tohoku university.
Headquarter address
6-6-40 Suite 203, Aza-Aoba, Aramaki, Aoba-ku, Sendai,
Miyagi, 980-8579 Japan
Tel: +81-22-398-6264
(022-398-6264 in Japan)
Fax: +81-22-398-6265
(022-398-6265 in Japan)
E-mail: info@t-microtec.com