〒980-8579 宮城県仙台市青葉区荒巻字青葉6-6-40 T-Biz203
T-Micro offers world-wide customers with Si interposer fabrication from just 1 wafer order.
Wafer size: 8" or 12"
Interposer size: ~36 x 26 mm (stitching is avialable for larger size. Actual result is 50x50 mm)
TSV: Cu 50 ~ 200 um depth / 5 ~ 20 um diameter / 10 ~ 40 um pitch
TSV method: TSV-Last (Main), TSV-First (TBD)
RDL: Combination with Cu damascene and Cu electroplating
(example: Cu-Dama 2 & Cu-Elp 2, Cu-Dama 4 only, etc)
Bump: Solder, Cu pillar w/ cap, Au, Au-In, etc
Please contact us for design rule, lead-time, NRE cost, etc.
(note: some information would need NDA.)
担当:元吉
T-Micro is the unique and advanced 3D/2.5D IC process and MEMS process-oriented company, originated in Tohoku University.
As an exclusive technical representative of GINTI "Global Integration Initiative" facility, we provide worldwide customers with 3D/ 2.5D/ MEMS full foundry service as well as partial process service by use of a complete line of state-of-the-art 200 and 300mm equipment in a cost-effective and short-TAT way for R/D, prototype, and small volume production.
東北マイクロテック(T-Micro)は、最先端の積層型三次元IC(3D-IC)技術をベースにした会社で、微細TSV(貫通配線)、マイクロバンプ接合等の新技術を入れ、今後のIT需要の拡大に呼応して、従来のICチップに高性能・高機能・小型化・省電力化といった新しい機能を付加します。新規の積層型センサの開発と並行してお客様に以下のサービスを提供致します。
弊社の技術・サービス、ホームページの内容に御意見やお問い合わせがございましたら、お気軽にご連絡ください。
Company
Technology
Foundry service
Service case study