Si Interposer

T-Micro offers world-wide customers with Si interposer fabrication from just 1 wafer order.

Wafer size: 8" or 12"

Interposer size: ~36 x 26 mm (stitching is avialable for larger size. Actual result is 50x50 mm)

TSV: Cu 50 ~ 200 um depth / 5 ~ 20 um diameter / 10 ~ 40 um pitch
TSV method: TSV-Last (Main), TSV-First (TBD)

RDL: Combination with Cu damascene and Cu electroplating
(example: Cu-Dama 2 & Cu-Elp 2, Cu-Dama 4 only, etc)

Bump: Solder, Cu pillar w/ cap, Au, Au-In, etc 

Please contact us for design rule, lead-time, NRE cost, etc.
(note: some information would need NDA.)

SiI_chip_shrinked.jpg

SiP_Wafer_Shrinked.jpg