〒980-8579 宮城県仙台市青葉区荒巻字青葉6-6-40 T-Biz203
President & CEO: Makoto Motoyoshi, Ph.D.
Dr.Motoyoshi is the semiconductor expert with more than 25 years of experiences at technology and business in Memory device and 3D Stacking LSI. He is former President & CEO of ZyCube, Inc., the leading 3D Stacking LSI for CMOS image sensor in Japan. He has presented seminars, lectures and invited presentations at domestic and international societies associated with 3D Stacking LSI over 40 times.
1982: Master of Electronic Engineering,
Tohoku University, Japan
1982: Hitachi Ltd., Musashi Works
1989: Kawasaki Steel Corp, LSI Research Center
1992: Sony Corp, LSI div.
2005: ZyCube, Inc., Director of Engineering
2006: ZyCube, Inc., Executive vice president
2008: ZyCube, Inc., President & CEO
Advisory CTO: Mitsumasa Koyanagi, Ph.D., Prof.
IEEE MEDAL LAUREATE / IEEE FELLOW
1974: Doctor of Electronic Engineering,
Tohoku University, Japan
1974: Hitachi, Ltd., Research Center
Researched DRAM process/device technology.
Invented Stacked Capacitor DRAM
1985: Xerox Palo Alto Research Center
Researched sub-micron device, TFT,
and digital/analog design
1988: Professor of Integrated System Research Center,
Hiroshima University
1994: Professor of Intelligent Machine Engineering,
Tohoku University
1995: Professor of Intelligent Machine Engineering,
Graduate School of Tohoku University Chairman
of Venture Lab, Tohoku University
2010: Professor of New Industry Creation Hatchery Center,
Tohoku University
(Prize-winning)
SSDM Award (1992)
IEEE Cledo Bruneti Award (1996)
Minister of Sciense and Technology Agency Award (2002), etc
(Publication)
Physics of VLSI Device (Maruzen)
Sub-micron Technology I, II (Maruzen), etc
担当:元吉
T-Micro is the unique and advanced 3D/2.5D IC process and MEMS process-oriented company, originated in Tohoku University.
As an exclusive technical representative of GINTI "Global Integration Initiative" facility, we provide worldwide customers with 3D/ 2.5D/ MEMS full foundry service as well as partial process service by use of a complete line of state-of-the-art 200 and 300mm equipment in a cost-effective and short-TAT way for R/D, prototype, and small volume production.
東北マイクロテック(T-Micro)は、最先端の積層型三次元IC(3D-IC)技術をベースにした会社で、微細TSV(貫通配線)、マイクロバンプ接合等の新技術を入れ、今後のIT需要の拡大に呼応して、従来のICチップに高性能・高機能・小型化・省電力化といった新しい機能を付加します。新規の積層型センサの開発と並行してお客様に以下のサービスを提供致します。
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