3D/2.5D/MEMS foundry service overview

Tohoku-MicroTec (T-Micro) provides worldwide clients (Company research div., University, Research Lab, etc) with Prototype-friendly 3D/2.5D/MEMS foundry service.

Foundry service summary:
(Service Process)
  3D such as TSV, Bump, Thinning and Bonding.
  2.5D by Si Interposer, Glass Interposer, etc.

(Service type)
  Partial prcoess service,
  Full process service.
We can handle only one wafer processing or only one die processing for an initial research project. 

(Stacking technology)
  Wafer to Wafer (WtW)
  Chip to Wafer (CtW)
  Chip to Chip (CtC) 

(Wafer size)
  12", 8", 6", and 2" wafer

(TSV technology)
  VIA-Last (Main) / VIA-First / VIA-Middle
  Cu, Poly-Si (Please ask us of W !!)
  Aspect ratio 1:10 (max) (Please ask us higher than 1:10 !!)
  Optical TSV is available. 

(Bump technology)
  Bump size: 2.5x2.5 um or larger
  Bump pitch: 5 um or longer
  Bump material: Au, Au/In, Cu, various solders, etc (please ask us !)

(Bonding technology)
  Melt, Solid Diffusion, etc (Please ask us of Direct/Fusion/Hybrid  !!) 

(Rerouting: RDL)
4 layers with Cu damascene
2 layers w/o Cu damascene 

(Unique service: only one service)
  Multi-chip bonding by Self-Assembly technology
  Micro-bump by Au cone bump 

More info: info@t-microtec.com

Inquiry: hasegawa@t-microtec.com