Dear Sirs,
We are planning to exhibit our new technology at 3DIC 2024.
Sept 25-27 @Sendai, Japan
See you at IEEE International 3D Systems Integration Conference!
Dear Sirs,
We are planning to exhibit our new technology at 3DIC 2024.
Sept 25-27 @Sendai, Japan
See you at IEEE International 3D Systems Integration Conference!
Dear Sirs,
We are planning to exhibit our 3D LSI chip and wafers in the process at Kyushu Semiconductor Industry Exhibition.
We will also introduce the video of our ultra-high speed and high precision CtW stacking technology.
Sept 25-26 @Fukuoka, Japan
See you at Kyushu Semiconductor Industry Exhibition!
2024 Leti Innovation Days
Jun. 25th-27th @Grenoble, France
Dear Sir/Madam,
Thank you for visiting us at 2024 Leti Innovation Days.
We exhibited our new technology. If you need any further information, please feel free to contact us.
[info@t-microtec.com]
This was our first time exhibiting at Leti Innovation Days, and we had a very meaningful time.
We were in an environment where exhibitors can directly develop business with each other in the period, and we were impressed by Leti's policy!
We would also like to thank Ms. Hélène (CEA-Leti), Ms. Kim, and the other Leti members for their thorough support. We would like to exhibit again.
See you again next year!
Makoto Motoyoshi (CEO)
2024 WCSM
Jun. 12th-14th @Budapest, Hungary
Dear Sirs,
Thank you for visiting us at 2024 WCSM.
We presented "Fine Pitch Gold Cylinder Bump Bomding Technology".
If you need any further information, please feel free to contact us.
[info@t-microtec.com]
Best regards,
Makoto Motoyoshi (CEO)
Dear Sirs,
We will exhibit our new technology at Leti Innobation Days 2024
June 25-27 @Grenoble, France
https://leti-innovation-days.com/2024/lid-world
Exhibition Jun. 25-27th 9:00~17:30 @ Partner's Corner, GROUND FLOOR, PALLADIUM, Grenoble
See you at Leti Innovation Days !
June 12th-14th at Budapest, Hungary
Dear Sirs,
We will present "Fine Pitch Gold Cylinder Bump Bonding Technology" at WCSM 2024
June 12-14 @Budapest, Hungary
https://www.bitcongress.com/wcsm2024/index.asp
Seminar Jun. 14 10:35-10:55 @ Britannia Ⅰ, GF, Radisson Blu Beke Hotel, Budapest
See you at WCSM !
January 15th-17th at Tokyo Big Sight
Dear Sirs,
Thank you for visiting us.
I really appreciate that we had informative and productive discussion with you.
If you need any information, please feel free to contact us.
(Info@t-microtec.com)
2019 Semicon Japan
Dec.11th-13th @ Tokyo Big Sight Japan
Dear Sirs,
Thank you for visiting us at 2019 SEMICON JAPAN.
If you need any further information, please do not hesitate in contact me.
[info@t-microtec.com]
Dear Sirs,
Thank you for visiting us at IEEE Nuclear Science Symposium & Medical Imaging Conference , Manchester.
We exhibited and presented our new micro-bump technology.
If you need any further information, please feel free to contact me at "info@t-microtec.com"
Best regards,
Makoto Motoyoshi (CEO)
Dec.15, 2018
Dear Sirs,
Thank you for visiting us at 2018 SEMICON JAPAN.
I really appreciated that I had many fruitful discussions with you.
If you need any further imformation, please do not hesitate in contact me at "info@t-microtec.com".
Best regards,
Makoto Motoyoshi (T-Micro/CEO)
Nov. 15, 2018
Dear Sirs,
Thank you for visiting us at IEEE NSS/MIC, Sydney.
We are so glad that you were interested in our 3D integration technology.
If you need any further information, please do not hesitate in contact me at "info@t-microtec.com".
Best regards,
Makoto Motoyoshi (T-Micro/CEO)
T-Micro was participating in CEATEC Japan 2018
(Sept 16-19 @ Makuhari Messe).
We presented about 3D-IC demo chip / Wafer and 3D-IC manufacturing service and demonstrated the low lost manufacturing technique for mini/micro LED Display.
Dear Sirs,
Thank you for visiting us at RADECS in Goteborg, Sweden.
We are so glad that you were interested our technologies.
If you need any further information, pleasew feel free to contact us. at info@t-microtec.com
Best regards,
Makoto Motoyoshi (T-Micro/CEO)
IEEE Nuclear & Space Radiation Effects Conference
Jul.16-Jul.20 @ Waikoloa, HI, USA
Dear Sirs,
Thank you for visiting us.
We believe our 3D-IC technologies provide you the more reliable device structure.
If you have interest in 3D integration, please feel free to contact us (info@t-microtec.com).
Best regards,
Makoto Motoyoshi
Dear Sirs,
We will exhibit our new 3D technology at SEMICON JAPAN 2017.
December 13-15 @ Tokyo Big Sight
Booth No. 1635 in Back-end & Overall Process Zone (Hall 1)
See you at Tokyo Big Sight
Nov 30, 2017. Conference & Exhibition
Semiconductor Packaging Symposium (MEPTEC)
~ Heterogenous integration, the road to implementation ~
Milpitas, CA
http://www.meptec.org/2017Q4/
We have a table booth.See you there!!
"3D Stacked Sensor/ Detector using u-Bump connection Technology" was presented at 2017 NSS/MIC (Nuclear Science Symposium & Medical Imaging Conference) in Atlanta during October 23-26.
www.nss-mic.org/2017/Welcome.asp
Thank you for visiting us.
We presented our "Self-Assembly" technology at Autotech council in Silicon valley on July 14.
Autotech council: http://www.autotechcouncil.com/
"Self-Assembly" is game-changing technology for throughput of Chip to Wafer bonding.
For more information:
December 14-16 @ Tokyo Big sight
Booth No. 1332 in Manufacturing Innovation Pavilion
Seminor Dec.16 12:40-13:30 @ Tech SPOT WEST
Thank you for visiting us.
Dear Sirs,
We will exhibit and present our new technology at Semicon Japan 2016
December 14-16 @ Tokyo Big sight
Booth No. 1332 in Manufacturing Innovation Pavilion
Seminor Dec.16 12:40-13:30 @ Tech SPOT WEST
See you at Semicon Japan !