Tohoku-MicroTec (T-Micro) provides worldwide clients (Company research div., University, Research Lab, etc) with Prototype-friendly 3D-IC foundry service.

3D-IC Foundry service summary:
(Service Process)
  Any or all 3D-IC process such as TSV, RDL, Bump, Thinning and Bonding.

(Service type)

  Full process or Partial prcoess service


We can handle only one wafer processing or only one die processing for an initial research project.

(Stacking technology)
  Wafer to Wafer (WtW)
  Chip to Wafer (CtW)
  Chip to Chip (CtC) 

(Wafer size)
  12", 8", 6", and 2" wafer

(TSV technology)
  VIA-Last (Main) / VIA-First / VIA-Middle
  Cu, Poly-Si (Please ask us of W !!)
  Aspect ratio 1:10 (max) (Please ask us higher than 1:10 !!)
  Optical TSV is available. 

(Bump technology)
Various solders, Cu pillar with cap, Au, Au/In, etc (please ask us !)

(Bonding technology)
  Melt, Solid Diffusion, etc (Please ask us of Direct/Fusion/Hybrid  !!) 

(Rerouting: RDL)
1-2 layers w/o CMP / Up to 4 layers with CMP 

(Unique service)
  Multi-chip bonding by Self-Assembly technology
  Ultra micro-bump: Au cone/cylinder bump (>2.5um size / >5um pitch)

More info:





T-Micro is the unique and advanced 3D/2.5D IC process and MEMS process-oriented company, originated in Tohoku University.
As an exclusive technical representative of GINTI "Global Integration Initiative" facility, we provide worldwide customers with 3D/ 2.5D/ MEMS full foundry service as well as partial process service by use of a complete line of state-of-the-art 200 and 300mm equipment in a cost-effective and short-TAT way for R/D, prototype, and small volume production.


  1. 数㎜角のチップから12インチウェハレベルの加工が可能で、お客様の3D-ICやMEMSのプロトタイプ試作、部分試作サポート、材料・装置評価用サンプル試作、少量生産をサポートします。
  2. 半導体微細加工技術及びMEMS製造技術をベースにバイオエレクトロニックデバイスの試作をサポートします。