3D-IC foundry service overview

Tohoku-MicroTec (T-Micro) provides worldwide clients (Company research div., University, Research Lab, etc) with Prototype-friendly 3D-IC foundry service.

3D-IC Foundry service summary:
(Service Process)
Any or all 3D-IC process such as TSV, RDL, Bump, Thinning and Bonding.

(Service type)

Full process or Partial prcoess service

We can handle only one wafer processing or only one die processing for an initial research project.

(Stacking technology)
Wafer to Wafer (WtW)
Chip to Wafer (CtW)
Chip to Chip (CtC)

(Wafer size)
12", 8", 6", and 2" wafer

(TSV technology)
VIA-Last (Main) / VIA-First / VIA-Middle
Cu, Poly-Si (Please ask us of W !!)
Aspect ratio 1:10 (max) (Please ask us higher than 1:10 !!)
Optical TSV is available.

(Bump technology)
Various solders, Cu pillar with cap, Au, Au/In, etc (please ask us !)

(Bonding technology)
Melt, Solid Diffusion, etc (Please ask us of Direct/Fusion/Hybrid !!)

(Rerouting: RDL)
1-2 layers w/o CMP / Up to 4 layers with CMP

(Unique service)
Multi-chip bonding by Self-Assembly technology
Ultra micro-bump: Au cone/cylinder bump (>2.5um size / >5um pitch)

More info: info@t-microtec.com

Inquiry: hasegawa@t-microtec.com

お問合せ・ご相談はこちら

お電話でのお問合せ・ご相談はこちら

022-398-6264

info@t-microtec.com

担当：元吉

お問合せはこちら

T-Micro is the unique and advanced 3D/2.5D IC process and MEMS process-oriented company, originated in Tohoku University.
As an exclusive technical representative of GINTI "Global Integration Initiative" facility, we provide worldwide customers with 3D/ 2.5D/ MEMS full foundry service as well as partial process service by use of a complete line of state-of-the-art 200 and 300mm equipment in a cost-effective and short-TAT way for R/D, prototype, and small volume production.

東北マイクロテック(T-Micro)は、最先端の積層型三次元IC(3D-IC)技術をベースにした会社で、微細TSV(貫通配線)、マイクロバンプ接合等の新技術を入れ、今後のIT需要の拡大に呼応して、従来のICチップに高性能・高機能・小型化・省電力化といった新しい機能を付加します。新規の積層型センサの開発と並行してお客様に以下のサービスを提供致します。