Micro Au cone bump

We developed and released micro-sized and fine-pitch Au cone bump technology. This technology was originally developed for "Pixel detector chip" used at Electron accelerator in High Energy Laboratories. This technology contributes to great performance improvement in high-end sensor chip field such as Compound sensor, X-ray sensor, IR sensor, etc.

Technology definition: Au cone bump
Bump material: Au
Bump size: 2.5 x 2.5 um
Bump pitch: 5 um (min)
  - High and flexible scalability
  - Large bonding margin
  - Low temperature process
Application: High-end sensor chips (Compound, X-ray, IR, SOI, etc) 

Check more details from the below:
Please click (right-click for download)
 - Slides: "3D Integratio
n Technology for Pixel Detector and Image Sensor using 3-um Au Cone Bump Junctions" (Pixel2014, Sep 2014)

 - Paper: "Stacked SOI Pixel Detector using Versatile Fine Pitch Micro-Bump Technology"






T-Micro is the unique and advanced 3D/2.5D IC process and MEMS process-oriented company, originated in Tohoku University.
As an exclusive technical representative of GINTI "Global Integration Initiative" facility, we provide worldwide customers with 3D/ 2.5D/ MEMS full foundry service as well as partial process service by use of a complete line of state-of-the-art 200 and 300mm equipment in a cost-effective and short-TAT way for R/D, prototype, and small volume production.


  1. 数㎜角のチップから12インチウェハレベルの加工が可能で、お客様の3D-ICやMEMSのプロトタイプ試作、部分試作サポート、材料・装置評価用サンプル試作、少量生産をサポートします。
  2. 半導体微細加工技術及びMEMS製造技術をベースにバイオエレクトロニックデバイスの試作をサポートします。