〒980-8579 宮城県仙台市青葉区荒巻字青葉6-6-40 T-Biz203
We developed and released micro-sized and fine-pitch Au cone bump technology. This technology was originally developed for "Pixel detector chip" used at Electron accelerator in High Energy Laboratories. This technology contributes to great performance improvement in high-end sensor chip field such as Compound sensor, X-ray sensor, IR sensor, etc.
Technology definition: Au cone bump
Bump material: Au
Bump size: 2.5 x 2.5 um
Bump pitch: 5 um (min)
Advantages:
- High and flexible scalability
- Large bonding margin
- Low temperature process
Application: High-end sensor chips (Compound, X-ray, IR, SOI, etc)
Check more details from the below:
Please click (right-click for download)
- Slides: "3D Integration Technology for Pixel Detector and Image Sensor using 3-um Au Cone Bump Junctions" (Pixel2014, Sep 2014)
- Paper: "Stacked SOI Pixel Detector using Versatile Fine Pitch Micro-Bump Technology"
担当:元吉
T-Micro is the unique and advanced 3D/2.5D IC process and MEMS process-oriented company, originated in Tohoku University.
As an exclusive technical representative of GINTI "Global Integration Initiative" facility, we provide worldwide customers with 3D/ 2.5D/ MEMS full foundry service as well as partial process service by use of a complete line of state-of-the-art 200 and 300mm equipment in a cost-effective and short-TAT way for R/D, prototype, and small volume production.
東北マイクロテック(T-Micro)は、最先端の積層型三次元IC(3D-IC)技術をベースにした会社で、微細TSV(貫通配線)、マイクロバンプ接合等の新技術を入れ、今後のIT需要の拡大に呼応して、従来のICチップに高性能・高機能・小型化・省電力化といった新しい機能を付加します。新規の積層型センサの開発と並行してお客様に以下のサービスを提供致します。
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