Custom Bilateral Multichannel Si Brain Probe Mfg service

We designs and manufactures Bilateral (double-sided) Multichannel Si Brain Probe, developed by use of T-MicroTec's proprietary 3DIC and MEMS process technology, for Brain Signal Recording / Stimulation. The Bilateral Multichannel Si Brain probe, named Neuronode100 series, integrates electrode sites on both Front and Back side for more effective signal recording and stimulation.

 

Specification :

Probe shaft material : Silicon (Si)

Electrode site material : Ir (Pt or Au optional)

Site diameter : 10, 15, 30 um or Custom

Probe thickness : 50 um or thicker

Probe length : 5, 10, 20, 33 mm or Custom

Probe width : 200 um (tapering)

Site number : Front 16 ch / Back 16 ch (Total 32 ch) or Custom

Site spacing : 50, 100, 200 um or Custom

Shank number : 1, 4 or Custom

Package : PCB / Implantable (Major system vendors compatible) or Custom

 

Custom Probe overview (example of 33 mm long) :

nn100-1 overview.jpg

- Probe length: 5, 10, 20, 33 mm or Custom

- TSV (Through Silicon Via) and Micro-Bump connection by advanced 3D IC and MEMS process technology.

- Precise alignment between front Si substrate and back Si substrate. 

- Micro-fabricated Si substrate with Ir electrode sites.

- Short width for localized measurement and minimization of tissue damage.

- Thin thickness ( less than 50 um) by unique Wafer thinning technology.

 

Electrode site design (exmaple of 16 ch) :

nn100-1 electorode design.jpg

Note: Customizable of every probe parameter: dimension, length, thickness, electrode site location, shape and number, shank number, etc.

 

Bonding pad layout :

nn100-1 bonding pad layout.jpg

- Bonding pad layout on one side for general probe package. 

 

Probe Package :

Acute package example :

nn100-1 probe package.jpg

 - Both Acute (PCB) and Chronic (Implantable) are available. All packages are compatible with major vendors' recording / stimulation system.

 

Availability :

Sample available for evaluation purpose.

Customization implemented so far : 2 cases

Download : Neuronode100 catalog

More info: info@t-microtec.com

 

Product example : Neuronode100 - 4 shank

Neuronode100 is the bilateral (double-sided) Si microelectrode, developed by use of T-microtec’s proprietary 3D-Stacking LSI process technology, for Brain Signal Processing Systems.Neuronode100 

As shown in Fig1: Structure of Neuronode100, it integrates multichannel probe-points on both a top side and a reverse side of every probe in order to more spatially acquire electroencephalographic signals than the conventional microelectrode products.

Fig1:Structure of Neuronode100

The Neuronode100’s probe-points on both sides are connected to output pads, which are connected to a processing system, through Si via. The Nueronode100 has 4 probes at a pitch of 300 μm. Each probe integrates 4 probe-points respectively on both sides. The Neuronode100 is 40 mm long, for reaching a deeper part of basal ganglia, with 100 μm wide and 100 μm thick. The probe-point is made of gold with equal length pattern Diameter of the probe-point is 15μm and the distance between the probe-points is 40 μm in center to center.

Fig2:Picture of Neuronode100 sample

Fig2:Picture of Neuronode100 sample

Fig2 is an enlarged picture of Neuronode100 sample. Output pads for bonding to external device are arranged at the end of the microelectrode. The Neuronode100 is fabricated by applying standard photolithography in bulk micromachining process.

More info: info@t-microtec.com

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担当:元吉

T-Micro is the unique and advanced 3D/2.5D IC process and MEMS process-oriented company, originated in Tohoku University.
As an exclusive technical representative of GINTI "Global Integration Initiative" facility, we provide worldwide customers with 3D/ 2.5D/ MEMS full foundry service as well as partial process service by use of a complete line of state-of-the-art 200 and 300mm equipment in a cost-effective and short-TAT way for R/D, prototype, and small volume production.

東北マイクロテック(T-Micro)は、最先端の積層型三次元IC(3D-IC)技術をベースにした会社で、微細TSV(貫通配線)、マイクロバンプ接合等の新技術を入れ、今後のIT需要の拡大に呼応して、従来のICチップに高性能・高機能・小型化・省電力化といった新しい機能を付加します。新規の積層型センサの開発と並行してお客様に以下のサービスを提供致します。

  1. 数㎜角のチップから12インチウェハレベルの加工が可能で、お客様の3D-ICやMEMSのプロトタイプ試作、部分試作サポート、材料・装置評価用サンプル試作、少量生産をサポートします。
  2. 半導体微細加工技術及びMEMS製造技術をベースにバイオエレクトロニックデバイスの試作をサポートします。

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