Custom Bilateral Multichannel Si Brain Probe

Custom Bilateral Multichannel Si Brain Probe Mfg service

We designs and manufactures Bilateral (double-sided) Multichannel Si Brain Probe, developed by use of T-MicroTec's proprietary 3DIC and MEMS process technology, for Brain Signal Recording / Stimulation. The Bilateral Multichannel Si Brain probe, named Neuronode100 series, integrates electrode sites on both Front and Back side for more effective signal recording and stimulation.

Specification :

Probe shaft material : Silicon (Si)

Electrode site material : Ir (Pt or Au optional)

Site diameter : 10, 15, 30 um or Custom

Probe thickness : 50 um or thicker

Probe length : 5, 10, 20, 33 mm or Custom

Probe width : 200 um (tapering)

Site number : Front 16 ch / Back 16 ch (Total 32 ch) or Custom

Site spacing : 50, 100, 200 um or Custom

Shank number : 1, 4 or Custom

Package : PCB / Implantable (Major system vendors compatible) or Custom

Custom Probe overview (example of 33 mm long) :

- Probe length: 5, 10, 20, 33 mm or Custom

- TSV (Through Silicon Via) and Micro-Bump connection by advanced 3D IC and MEMS process technology.

- Precise alignment between front Si substrate and back Si substrate.

- Micro-fabricated Si substrate with Ir electrode sites.

- Short width for localized measurement and minimization of tissue damage.

- Thin thickness ( less than 50 um) by unique Wafer thinning technology.

Electrode site design (exmaple of 16 ch) :

Note: Customizable of every probe parameter: dimension, length, thickness, electrode site location, shape and number, shank number, etc.

Bonding pad layout :

- Bonding pad layout on one side for general probe package.

Probe Package :

Acute package example :

- Both Acute (PCB) and Chronic (Implantable) are available. All packages are compatible with major vendors' recording / stimulation system.

Availability :

Sample available for evaluation purpose.

Customization implemented so far : 2 cases

Download : Neuronode100 catalog

More info: info@t-microtec.com

Product example : Neuronode100 - 4 shank

More info: info@t-microtec.com

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022-398-6264

info@t-microtec.com

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T-Micro is the unique and advanced 3D/2.5D IC process and MEMS process-oriented company, originated in Tohoku University.
As an exclusive technical representative of GINTI "Global Integration Initiative" facility, we provide worldwide customers with 3D/ 2.5D/ MEMS full foundry service as well as partial process service by use of a complete line of state-of-the-art 200 and 300mm equipment in a cost-effective and short-TAT way for R/D, prototype, and small volume production.

東北マイクロテック(T-Micro)は、最先端の積層型三次元IC(3D-IC)技術をベースにした会社で、微細TSV(貫通配線)、マイクロバンプ接合等の新技術を入れ、今後のIT需要の拡大に呼応して、従来のICチップに高性能・高機能・小型化・省電力化といった新しい機能を付加します。新規の積層型センサの開発と並行してお客様に以下のサービスを提供致します。