〒980-8579 宮城県仙台市青葉区荒巻字青葉6-6-40 T-Biz203
Au cylinder bump is T-Micro's uniuqe micro-bump technology. Now T-Micro provides Au micro cylinder bump process service to world-wide customers from only one-wafer. Au cylinder bump supports both one bump/one connection and multiple bumps/one connection so that electrical connectivity yield becomes higher than standard Au bump.
(Au cylinder bump spec)
- Size >3.5um diameter (Design-able)
- Pitch >7um
- Height <3um (Design-able)
- Au wall thickness ~100nm
Au cylinder bump is hollow and formed by thin Au wall and Au base.
1) Bump size and shape scalability
Au cylinder bump's size and shape are design-able based on client's spec.
2) Large bonding margin
Since Au cylinder bump's inside is hollow, it well deforms at bonding.
担当:元吉
T-Micro is the unique and advanced 3D/2.5D IC process and MEMS process-oriented company, originated in Tohoku University.
As an exclusive technical representative of GINTI "Global Integration Initiative" facility, we provide worldwide customers with 3D/ 2.5D/ MEMS full foundry service as well as partial process service by use of a complete line of state-of-the-art 200 and 300mm equipment in a cost-effective and short-TAT way for R/D, prototype, and small volume production.
東北マイクロテック(T-Micro)は、最先端の積層型三次元IC(3D-IC)技術をベースにした会社で、微細TSV(貫通配線)、マイクロバンプ接合等の新技術を入れ、今後のIT需要の拡大に呼応して、従来のICチップに高性能・高機能・小型化・省電力化といった新しい機能を付加します。新規の積層型センサの開発と並行してお客様に以下のサービスを提供致します。
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