Au cylinder bump is T-Micro's uniuqe micro-bump technology. Now T-Micro provides Au micro cylinder bump process service to world-wide customers from only one-wafer. Au cylinder bump supports both one bump/one connection and multiple bumps/one connection so that electrical connectivity yield becomes higher than standard Au bump.

(Au cylinder bump spec)
- Size >3.5um diameter (Design-able)
- Pitch >7um
- Height <3um (Design-able)
- Au wall thickness ~100nm

Au cylinder bump is hollow and formed by thin Au wall and Au base.

1) Bump size and shape scalability

Au cylinder bump's size and shape are design-able based on client's spec.

2) Large bonding margin

Since Au cylinder bump's inside is hollow, it well deforms at bonding.