Si Interposer projects

(1) Si Interposer Test chip

Chip size: 25mm x 30mm
Wafer size: 12"
TSV: 5um diameter / 50um depth / 20um pitch
RDL: Cu damascene 2 layer & Cu electroplating 2 layer
T-Micro Si Interposer Test Chip.pdf
More details:
Test circuit IP is avialable for your projects.

(2) Large size Si Interposer chip

Chip size: 50mm x 50mm
Wafer size: 12"
TSV: 30um diameter / 200um depth / 60um pitch
RDL: Cu electrplating 2 layer
More details:




T-Micro is the unique and advanced 3D/2.5D IC process and MEMS process-oriented company, originated in Tohoku University.
As an exclusive technical representative of GINTI "Global Integration Initiative" facility, we provide worldwide customers with 3D/ 2.5D/ MEMS full foundry service as well as partial process service by use of a complete line of state-of-the-art 200 and 300mm equipment in a cost-effective and short-TAT way for R/D, prototype, and small volume production.


  1. 数㎜角のチップから12インチウェハレベルの加工が可能で、お客様の3D-ICやMEMSのプロトタイプ試作、部分試作サポート、材料・装置評価用サンプル試作、少量生産をサポートします。
  2. 半導体微細加工技術及びMEMS製造技術をベースにバイオエレクトロニックデバイスの試作をサポートします。