(1) Si Interposer Test chip

Chip size: 25mm x 30mm
Wafer size: 12"
TSV: 5um diameter / 50um depth / 20um pitch
RDL: Cu damascene 2 layer & Cu electroplating 2 layer
T-Micro Si Interposer Test Chip.pdf
More details: info@t-microtec.com
Test circuit IP is avialable for your projects.

(2) Large size Si Interposer chip

Chip size: 50mm x 50mm
Wafer size: 12"
TSV: 30um diameter / 200um depth / 60um pitch
RDL: Cu electrplating 2 layer
Large_Si_Interposer.pdf
More details: info@t-microtec.com