Partial process service

By use of our new, complete, and cost-competitive 3D-IC/Si-Interposer/MEMS line of 200/300 mm wafer with state‐of‐the‐art equipments such as:
- Lithography (i-line stepper with IR alignment)
- Si/SiO2 deep etch

- CVD (TSV liner)
- Sputter
- Electroplating
- Metal etch
- Temporary bonding
- Temporary debonding,

We provide worldwide customers with a cost‐effective and short‐term TAT partial process service as below:

- Wafer thinning,

- TSV making,

- Si/SiO2 deep trench,

- Bump formulation,

- RDL (Cu damascene is available),

- Bonding, etc.




T-Micro is the unique and advanced 3D/2.5D IC process and MEMS process-oriented company, originated in Tohoku University.
As an exclusive technical representative of GINTI "Global Integration Initiative" facility, we provide worldwide customers with 3D/ 2.5D/ MEMS full foundry service as well as partial process service by use of a complete line of state-of-the-art 200 and 300mm equipment in a cost-effective and short-TAT way for R/D, prototype, and small volume production.


  1. 数㎜角のチップから12インチウェハレベルの加工が可能で、お客様の3D-ICやMEMSのプロトタイプ試作、部分試作サポート、材料・装置評価用サンプル試作、少量生産をサポートします。
  2. 半導体微細加工技術及びMEMS製造技術をベースにバイオエレクトロニックデバイスの試作をサポートします。