T-Micro offers world-wide customers with Si interposer fabrication from just 1 wafer order.
Wafer size: 8" or 12"
Interposer size: ~36 x 26 mm (stitching is avialable for larger size. Actual result is 50x50 mm)
TSV: Cu 50 ~ 200 um depth / 5 ~ 20 um diameter / 10 ~ 40 um pitch
TSV method: TSV-Last (Main), TSV-First (TBD)
RDL: Combination with Cu damascene and Cu electroplating
(example: Cu-Dama 2 & Cu-Elp 2, Cu-Dama 4 only, etc)
Bump: Solder, Cu pillar w/ cap, Au, Au-In, etc
Please contact us for design rule, lead-time, NRE cost, etc.
(note: some information would need NDA.)
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