Our sincere thanks to everyone who visited the Tohoku-MicroTec Co., Ltd. (T-Micro) display at the Miyagi Prefecture / Sendai City booth in the Japan Pavilion during SEMICON Taiwan 2026, held in Taipei, Taiwan, on September 2–4, 2026.

 

 It was a pleasure to meet you in person and introduce our technologies and processing capabilities, including:

• 3D-IC and 2.5D IC technologies
• Through-silicon via (TSV) processing
• Redistribution layer (RDL) fabrication
• Bump formation

 

 We hope to build on these connections through future collaboration, helping you address your technical challenges with technologies and services that support semiconductor prototyping and development.

 We welcome further questions about our exhibits, as well as inquiries regarding 3D integration, silicon interposers, heterogeneous device stacking, and chiplet prototyping.
Whether or not you were able to attend, we would be happy to discuss your needs through the inquiry form below.

 

 Thank you for your continued support of T-Micro.
Form : Contact Form

 

We look forward to seeing you again!

 

 Links

• Event Official : SEMICON Taiwan
• Tohoku Microtec Official : Home Page
• Contact Form : Contact Form