Dear Sirs,

We will exhibit our new 3D technology at SEMICON JAPAN 2017.

December 13-15 @ Tokyo Big Sight

www.semiconjapan.org

Booth No. 1635 in Back-end & Overall Process Zone (Hall 1)

See you at Tokyo Big Sight

Nov 30, 2017. Conference & Exhibition
Semiconductor Packaging Symposium (MEPTEC)
~ Heterogenous integration, the road to implementation ~
Milpitas, CA
http://www.meptec.org/2017Q4/

We have a table booth.See you there!!

Dear Sirs,

We will exhibit and present our new technology at Semicon Japan 2016

December 14-16 @ Tokyo Big sight

www.semicon japan.org

Booth No. 1332 in Manufacturing Innovation Pavilion

Seminor Dec.16 12:40-13:30 @ Tech SPOT WEST

 See you at Semicon Japan !

October 29-November 06, 2016 Conference & Exhibition

2016 IEEE Nuclear Science Symposium & Medical Imaging Conference

Strasbourg, France

http://www.nss-mic.org/2016

We have a table booth (Exhibition period 11/1-3)

Also we present our micro-bump technology (11/2  17:00~@Schuman)

See you at 2016 MSS/MIC

August 3 -10, 2016 Conference & Exhibition
ICHEP2016
38th International Conference on High Energy Physics
Chicago, IL
We have a table booth (Exhibition 8/7-10)
https://www.ichep2016.org/
See you at ICHEP2016 !!

July 12-14, 2016. Conference & ExhibitionSemiconWest 2016  Booth No. 733
San Francisco, CA 
http://www.semiconwest.org/ 

May 31-June 3, 2016. Conference & Exhibition
ECTC2016 (IEEE Electronic Components and Technology Conference), Booth No.219
Las Vegas, NV
http://ectc.net/

See you at ECTC2016!!

Good meeting you at No 1232 in SemiconWest 2015 during July 14-16 !!

We announced our new patented Micro Au Cone Bump technology.

Technology: Micro Au-Cone Bump

Bump size: 2.5um x 2.5um

Bump Pitch: 5 um (Minimum)

Material: Au

Target Application: Sensors (Compound, X-Ray, SOI, etc)

For detailed information, please contact hasegawa@t-microtec.com (San Jose CA) 

T-Micro attends 3D-ASIP 2014 !!

3D Architectures for Semiconductor Integration and Packaginghttp://www.3dasip.org/

December 10-12, 2014Burlingame, CA

We have a table-booth, please join us !!

Please visit our booth at the following conference & exhibition in November 2014 !!

Nov 15 - 19, 2014. Conference & ExhibitionNeuroscience 2014

Booth No. 1913Washington D.C.
http://www.sfn.org/annual-meeting/neuroscience-2014

T-Micro presents Omni-directional Brain probe for Deep brain recording & Stimulation !

Nov 12 - 13, 2014. Conference
T Sensors Summit for Trillion Sensor Roadmap
San Diego CA
http://www.tsensorssummit.org/

T-Micro presents 3D-IC/Si Interposer/MEMS foundry service by GINTI's 200/300mm wafer process line.

Thank you so much for visiting T-Micro and GINTI (Global Integration Initiative: http://www.ginti.niche.tohoku.ac.jp ) booth at Semicon Japan 2013 ! 

(Semicon Japan ) http://www.semiconjapan.org
Dec.4-Dec.6, 2013
Makuhari Messe, Chiba, Japan
Booth: Hall 1, D1-003

Dec. 4  12:30~12:50 
Dec. 5  12:00~12:20 (Release Presentation)
Location:

Thank you for visiting T-micro/GINTI booth at IEEE International 3D Integration Conference 2013 in San Francisco, CA, USA on Oct 2-4, 2013.

T-micro/GINTI team exhibited the brand-new "Global Integration Initiative" activity, which is 3D/2.5D IC process service with a complete line of 200 and 300mm equipments as one stop-service of TSV design, mfg, pkg and test for R/D, prototype, and small volume production.

GINITI specilizes Wafer on Wafer, Chip on Chip as well as Chip on Wafer, which stack multiple layers of a variety of 2D conventional KGDs (Known Good Die) on a support wafer.

More details of GINTI. Please click here !