2019 Semicon Japan
Dec.11th-13th @ Tokyo Big Sight Japan
Dear Sirs,
Thank you for visiting us at 2019 SEMICON JAPAN.
If you need any further information, please do not hesitate in contact me.
[info@t-microtec.com]
Dear Sirs,
Thank you for visiting us at IEEE Nuclear Science Symposium & Medical Imaging Conference , Manchester.
We exhibited and presented our new micro-bump technology.
If you need any further information, please feel free to contact me at "info@t-microtec.com"
Best regards,
Makoto Motoyoshi (CEO)
Dec.15, 2018
Dear Sirs,
Thank you for visiting us at 2018 SEMICON JAPAN.
I really appreciated that I had many fruitful discussions with you.
If you need any further imformation, please do not hesitate in contact me at "info@t-microtec.com".
Best regards,
Makoto Motoyoshi (T-Micro/CEO)
Nov. 15, 2018
Dear Sirs,
Thank you for visiting us at IEEE NSS/MIC, Sydney.
We are so glad that you were interested in our 3D integration technology.
If you need any further information, please do not hesitate in contact me at "info@t-microtec.com".
Best regards,
Makoto Motoyoshi (T-Micro/CEO)
T-Micro was participating in CEATEC Japan 2018
(Sept 16-19 @ Makuhari Messe).
We presented about 3D-IC demo chip / Wafer and 3D-IC manufacturing service and demonstrated the low lost manufacturing technique for mini/micro LED Display.
Dear Sirs,
Thank you for visiting us at RADECS in Goteborg, Sweden.
We are so glad that you were interested our technologies.
If you need any further information, pleasew feel free to contact us. at info@t-microtec.com
Best regards,
Makoto Motoyoshi (T-Micro/CEO)
IEEE Nuclear & Space Radiation Effects Conference
Jul.16-Jul.20 @ Waikoloa, HI, USA
Dear Sirs,
Thank you for visiting us.
We believe our 3D-IC technologies provide you the more reliable device structure.
If you have interest in 3D integration, please feel free to contact us (info@t-microtec.com).
Best regards,
Makoto Motoyoshi
Dear Sirs,
We will exhibit our new 3D technology at SEMICON JAPAN 2017.
December 13-15 @ Tokyo Big Sight
Booth No. 1635 in Back-end & Overall Process Zone (Hall 1)
See you at Tokyo Big Sight
Nov 30, 2017. Conference & Exhibition
Semiconductor Packaging Symposium (MEPTEC)
~ Heterogenous integration, the road to implementation ~
Milpitas, CA
http://www.meptec.org/2017Q4/
We have a table booth.See you there!!
"3D Stacked Sensor/ Detector using u-Bump connection Technology" was presented at 2017 NSS/MIC (Nuclear Science Symposium & Medical Imaging Conference) in Atlanta during October 23-26.
www.nss-mic.org/2017/Welcome.asp
Thank you for visiting us.
We presented our "Self-Assembly" technology at Autotech council in Silicon valley on July 14.
Autotech council: http://www.autotechcouncil.com/
"Self-Assembly" is game-changing technology for throughput of Chip to Wafer bonding.
For more information:
December 14-16 @ Tokyo Big sight
Booth No. 1332 in Manufacturing Innovation Pavilion
Seminor Dec.16 12:40-13:30 @ Tech SPOT WEST
Thank you for visiting us.
Dear Sirs,
We will exhibit and present our new technology at Semicon Japan 2016
December 14-16 @ Tokyo Big sight
Booth No. 1332 in Manufacturing Innovation Pavilion
Seminor Dec.16 12:40-13:30 @ Tech SPOT WEST
See you at Semicon Japan !
Nov. 03, 2016
Dear Sirs,
Thank you for visiting us at IEEE NSS/MIC, Strasbourg.
We are so glad that you were interested in our technologies.
If you need any further information, please do not hesitate in contact me at "info@t-microtec.com".
Best regards,
Makoto Motoyoshi (T-Micro/CEO)
October 29-November 06, 2016 Conference & Exhibition
2016 IEEE Nuclear Science Symposium & Medical Imaging Conference
Strasbourg, France
We have a table booth (Exhibition period 11/1-3)
Also we present our micro-bump technology (11/2 17:00~@Schuman)
See you at 2016 MSS/MIC
August 3 -10, 2016 Conference & Exhibition
ICHEP2016
38th International Conference on High Energy Physics
Chicago, IL
We have a table booth (Exhibition 8/7-10)
https://www.ichep2016.org/
See you at ICHEP2016 !!
July 12-14, 2016. Conference & ExhibitionSemiconWest 2016 Booth No. 733
San Francisco, CA
http://www.semiconwest.org/
May 31-June 3, 2016. Conference & Exhibition
ECTC2016 (IEEE Electronic Components and Technology Conference), Booth No.219
Las Vegas, NV
http://ectc.net/
See you at ECTC2016!!
Good meeting you at No 1232 in SemiconWest 2015 during July 14-16 !!
We announced our new patented Micro Au Cone Bump technology.
Technology: Micro Au-Cone Bump
Bump size: 2.5um x 2.5um
Bump Pitch: 5 um (Minimum)
Material: Au
Target Application: Sensors (Compound, X-Ray, SOI, etc)
For detailed information, please contact hasegawa@t-microtec.com (San Jose CA)
T-Micro attends 3D-ASIP 2014 !!
3D Architectures for Semiconductor Integration and Packaginghttp://www.3dasip.org/
December 10-12, 2014Burlingame, CA
We have a table-booth, please join us !!
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