T ohoku-MicroTec (T-Micro) was participating in 42nd INTERNEPCON JAPAN !!

Jan. 16-18, 2013  10:00-18:00 (10:00-17:00 on Jan. 18)    , Tokyo Big Sight, Japan

http://www.nepcon.jp/en/To-Exhibit/

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We presented about (1)3D IC demo chips, (2) Several type of Barain microprobes for neuroscience, and (3) 3D IC manufacturing service.

We can make 3D stack chip using diced LSI chips. And 3D processing using 8"/12" LSI wafer and 12" Si interposer with high aspect ratio TSV (up to 10) will be availavle from this April.

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3D-stacked LSI is the next generation device which is expected to reduce power consumption down to half. From the view of clean environment, establishment of stable, secure and cost-effective technology of 3D stacked LSI is these days craved for. In anticipation of substitution for the current 2D LSI and promotion of the 3D-stacked LSI in a variety of market segments, further research and development are essential.

 Tohoku-MicroTec Co., Ltd. (Tohoku-MicroTec), established at Sendai, Japan in April, 2010, is the unique and leading 3D-Stacked LSI process-oriented company, utilizing the next generation process & manufacturing technology, originated in Tohoku university, of fine-pitch Through-Silicon-VIA (TSV), Microbump, Thinning, Bonding and Alignment.

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In wide and tight collaboration with New Industry Creation Hatchery Center of Tohoku University, we research and develop Bio-Electronics products for Neuroscience, provide 3D-Stacked LSI prototype manufacturing services at a drastic cost-effective way, and counsel on the development related to 3D-Stacked LSI process.

T-Microtec opened its headquarter office at T-Biz building in Tohoku university.

Office

Headquarter address

6-6-40 Suite 203, Aza-Aoba, Aramaki, Aoba-ku, Sendai, Miyagi, 980-8579 Japan

Tel: +81-22-398-6264
       (022-398-6264 in Japan)

Fax: +81-22-398-6265

       (022-398-6265 in Japan)

E-mail: info@t-microtec.com