Event in November 2014!

Please visit our booth at the following conference & exhibition in November 2014 !!

Nov 15 - 19, 2014. Conference & ExhibitionNeuroscience 2014

Booth No. 1913Washington D.C.
http://www.sfn.org/annual-meeting/neuroscience-2014

T-Micro presents Omni-directional Brain probe for Deep brain recording & Stimulation !

 

Nov 12 - 13, 2014. Conference
T Sensors Summit for Trillion Sensor Roadmap
San Diego CA
http://www.tsensorssummit.org/

T-Micro presents 3D-IC/Si Interposer/MEMS foundry service by GINTI's 200/300mm wafer process line.

 

Thank you for Visiting GINTI/T-Micro Booth at SemiconJapan 2013

Thank you so much for visiting T-Micro and GINTI (Global Integration Initiative: http://www.ginti.niche.tohoku.ac.jp ) booth at Semicon Japan 2013 ! 

(Semicon Japan ) http://www.semiconjapan.org
Dec.4-Dec.6, 2013
Makuhari Messe, Chiba, Japan
Booth: Hall 1, D1-003

Professor. Koyanagi and T-Mciro CEO Ph.D Motoyoshi make a presentation of T-Micro/GINTI's 2.5/3D IC process service by a complete line of 200/300mm equipment and our new and cost-effective protptype making methodology by Chio-on-Wafer using conventional/customized 2D chip dies at TechSTAGE EAST

Dec. 4  12:30~12:50 
Dec. 5  12:00~12:20 (Release Presentation)
Location:

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Thank you for visiting T-micro/GINTI booth at IEEE 3D Integration Conference 2013

Thank you for visiting T-micro/GINTI booth at IEEE International 3D Integration Conference 2013 in San Francisco, CA, USA on Oct 2-4, 2013.

T-micro/GINTI team exhibited the brand-new "Global Integration Initiative" activity, which is 3D/2.5D IC process service with a complete line of 200 and 300mm equipments as one stop-service of TSV design, mfg, pkg and test for R/D, prototype, and small volume production.

3DIC conf 2013 booth

GINITI specilizes Wafer on Wafer, Chip on Chip as well as Chip on Wafer, which stack multiple layers of a variety of 2D conventional KGDs (Known Good Die) on a support wafer.

More details of GINTI. Please click here !

T ohoku-MicroTec (T-Micro) was participating in 42nd INTERNEPCON JAPAN !!

Jan. 16-18, 2013  10:00-18:00 (10:00-17:00 on Jan. 18)    , Tokyo Big Sight, Japan

http://www.nepcon.jp/en/To-Exhibit/

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We presented about (1)3D IC demo chips, (2) Several type of Barain microprobes for neuroscience, and (3) 3D IC manufacturing service.

We can make 3D stack chip using diced LSI chips. And 3D processing using 8"/12" LSI wafer and 12" Si interposer with high aspect ratio TSV (up to 10) will be availavle from this April.

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3D-stacked LSI is the next generation device which is expected to reduce power consumption down to half. From the view of clean environment, establishment of stable, secure and cost-effective technology of 3D stacked LSI is these days craved for. In anticipation of substitution for the current 2D LSI and promotion of the 3D-stacked LSI in a variety of market segments, further research and development are essential.

 Tohoku-MicroTec Co., Ltd. (Tohoku-MicroTec), established at Sendai, Japan in April, 2010, is the unique and leading 3D-Stacked LSI process-oriented company, utilizing the next generation process & manufacturing technology, originated in Tohoku university, of fine-pitch Through-Silicon-VIA (TSV), Microbump, Thinning, Bonding and Alignment.

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In wide and tight collaboration with New Industry Creation Hatchery Center of Tohoku University, we research and develop Bio-Electronics products for Neuroscience, provide 3D-Stacked LSI prototype manufacturing services at a drastic cost-effective way, and counsel on the development related to 3D-Stacked LSI process.

T-Microtec opened its headquarter office at T-Biz building in Tohoku university.

Office

Headquarter address

6-6-40 Suite 203, Aza-Aoba, Aramaki, Aoba-ku, Sendai, Miyagi, 980-8579 Japan

Tel: +81-22-398-6264
       (022-398-6264 in Japan)

Fax: +81-22-398-6265

       (022-398-6265 in Japan)

E-mail: info@t-microtec.com

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東北マイクロテック
株式会社

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〒980-8579
宮城県仙台市青葉区
荒巻字青葉６-６-40　T-Biz203

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