Tohoku Microtec Co., Ltd. will exhibit at the 2nd [Kyushu] Semiconductor Industry Exhibition to be held in Japan.

 The [Kyushu] Semiconductor Industry Exhibition is a trade show hosted at Marine Messe Fukuoka (Fukuoka City, Fukuoka Prefecture).
It is billed as "Kyushu's first specialized exhibition dedicated to the semiconductor industry."

 On the day of the event, we will introduce Tohoku Microtec's latest technologies related to 3D-IC (3D LSI).
We will exhibit at Booth B9-33 - please feel free to drop by!

 Exhibit Overview

• Dates                   : October 8 (Wed) - October 9 (Thu), 2025, 10:00-17:00
• Venue / Booth     : Marine Messe Fukuoka, Hall B / Booth B9-33
• Pre-event inquiry : Contact Form
• Note                     : We provide contract manufacturing, prototyping, and foundry services for 3D-IC (3D LSI) advanced packaging and micro-fabrication (e. g., micro-TSV, micro-bump). Please feel free to contact us.

Links

• Event (official)                   : https://k-semi.jp/
• Tohoku Microtec (official) : https://www.t-microtec.com/

Dear Sirs,

We will exhibit at CEA-Leti Innovation Days / LID World Summit

June 17-19, 2025 @Grenoble, France

Visit partner's corner booth to see our new technology about 3D-LSI, please.

https://leti-innovation-days.com/2025/lid-world/partners-corner/

Exhibition Jun. 17-19th 9:30~16:30 @ Partner's Corner, GROUND FLOOR, PALLADIUM, Grenoble

 See you at Leti Innovation Days !

Dear Sirs,

We are planning to attend at 39th NEPCON JAPAN.
Our products will be exhibited in the booth of SEIKA CORPORATION.
We are looking forward to seeing you there.

Jan 22 - 24 @Tokyo Big Sight, Japan

NEPCON JAPAN - January 22-24, 2025 at Tokyo

See you at 39th NEPCON JAPAN!

Dear Sirs,

We are planning to attend at SEMICON Japan 2024.
Let's discuss about our new technology there.

Dec 11 - 13 @Tokyo Big Sight, Japan

Home | SEMICON Japan

See you at SEMICON Japan 2024!

Dear Sirs,

We are planning to exhibit our new technology at CEATEC 2024.

Oct. 15-18 @Makuhari Messe, Japan

Our booth bumber is "8H522".

https://www.ceatec.com/en/

See you at CEATEC 2024!

Dear Sirs,

We are planning to exhibit our 3D LSI chip and wafers in the process at Kyushu Semiconductor Industry Exhibition.

We will also introduce the video of our ultra-high speed and high precision CtW stacking technology.

Sept 25-26 @Fukuoka, Japan

https://k-semi.jp/#sec9

 See you at Kyushu Semiconductor Industry Exhibition!

Dear Sirs,

We will exhibit our new technology at Leti Innobation Days 2024

June 25-27 @Grenoble, France

https://leti-innovation-days.com/2024/lid-world

Exhibition Jun. 25-27th 9:00~17:30 @ Partner's Corner, GROUND FLOOR, PALLADIUM, Grenoble

 See you at Leti Innovation Days !

June 12th-14th at Budapest, Hungary

Dear Sirs,

We will present "Fine Pitch Gold Cylinder Bump Bonding Technology" at WCSM 2024

June 12-14 @Budapest, Hungary

https://www.bitcongress.com/wcsm2024/index.asp

Seminar Jun. 14 10:35-10:55 @ Britannia Ⅰ, GF, Radisson Blu Beke Hotel, Budapest

 See you at WCSM !

Dec.15, 2018

Dear Sirs,

Thank you for visiting us at 2018 SEMICON JAPAN.

I really appreciated that I had many fruitful discussions with you.

If you need any further imformation, please do not hesitate in contact me at "info@t-microtec.com".

Best regards,

Makoto Motoyoshi (T-Micro/CEO)