Tohoku Microtec Co., Ltd. will be exhibiting at SEMICON Japan 2025, to be held in Tokyo, Japan.
 

 SEMICON Japan 2025 is one of the largest semiconductor-related events in Japanーan international exhibition for electronics manufacturing that covers everything from semiconductor manufacturing technologies, equipment, and materials to SMART applications such as automobiles and IoT devices.

 On the day of the event, Tohoku Microtec engineer with over 20 years of experience in 3D technology development will give a presentation on how we started working on 3D technologies, how these technologies have evolved, and future trends.

 We will give a talk at the TechSPOT stage in West Hall 2 on Friday, Decemcer 19, 2025, from 11:30 to 11:50.

We will also have a booth in the TOUHOKU Pavilion (West Hall 2, booth W2477), so please feel free to stop by.

 Seminar Over view

• Title : Evolution and Future Outlook of 3D/2.5D Technologies
• Date & Time : Friday, December 19, 2025, 11:30-11:50
• Location : TechSPOT, West Hall 2
• Outline : Our engineer who has been engaged in 3D technology development for over 20 years will present how 3D technology development began, how it has progressed, and future trend.
• Pre-event inquiry : Please contact us in advance via our contact form.

 Exhibit Overview

• Dates : December 17(Wed) - December 19(Fri), 2025, 10:00-17:00
• Venue : Tokyo Big Sight (Tokyo, Japan)
• Booth : TOUHOKU Pavilion, West Hall 2, W2477
• Pre-event inquiry : Please contact us in advance via our contact form.
• ✅About T-Micro : We are a foundry specializing in advanced 3D-IC(3D-LSI) assembly, offering proprietary processes that enable integration from chip level up to 12-inch wafer level.

​
 What You'll See at Our Booth

 ❶ TSV Technology ー customizable sizes and structures for diverse device requirements.
 ❷ Micro-Bump Technology ー fine-pitch interconnects for high-density, low-resistance connections.
 ❸ Proceessing Technology ー thinning, bonding, molding, and heterogeneous stacking to maximize 3D integration freedom.
 

 Useful Links

• SEMICON Japan 2025(official site)
• Tohoku MicroTec(official site)
  ​

 Contact

Tel : +81-22-398-6264

Email : info.tm@t-microtec.com

We look forward to meeting you in Tokyo!

 Tohoku Microtec Co., Ltd. will attend IEEE NSS/MIC/RTSD 2025 in Yokohama as visitors. 

 This international conference brings together researchers and industry to share the latest advances in nuclear science, medical imaging, and room-temperature semiconductor detectors.
The event will be held at Pacifico Yokohama North.

 Tohoku Microtec Co., Ltd. will exhibit at the 2nd [Kyushu] Semiconductor Industry Exhibition to be held in Japan.

 The [Kyushu] Semiconductor Industry Exhibition is a trade show hosted at Marine Messe Fukuoka (Fukuoka City, Fukuoka Prefecture).
It is billed as "Kyushu's first specialized exhibition dedicated to the semiconductor industry."

 On the day of the event, we will introduce Tohoku Microtec's latest technologies related to 3D-IC (3D LSI).
We will exhibit at Booth B9-33 - please feel free to drop by!

 Exhibit Overview

• Dates                   : October 8 (Wed) - October 9 (Thu), 2025, 10:00-17:00
• Venue / Booth     : Marine Messe Fukuoka, Hall B / Booth B9-33
• Pre-event inquiry : Contact Form
• Note                     : We provide contract manufacturing, prototyping, and foundry services for 3D-IC (3D LSI) advanced packaging and micro-fabrication (e. g., micro-TSV, micro-bump). Please feel free to contact us.

Links

• Event (official)                   : https://k-semi.jp/
• Tohoku Microtec (official) : https://www.t-microtec.com/

Dear Sirs,

We will exhibit at CEA-Leti Innovation Days / LID World Summit

June 17-19, 2025 @Grenoble, France

Visit partner's corner booth to see our new technology about 3D-LSI, please.

https://leti-innovation-days.com/2025/lid-world/partners-corner/

Exhibition Jun. 17-19th 9:30~16:30 @ Partner's Corner, GROUND FLOOR, PALLADIUM, Grenoble

 See you at Leti Innovation Days !

Dear Sirs,

We are planning to attend at 39th NEPCON JAPAN.
Our products will be exhibited in the booth of SEIKA CORPORATION.
We are looking forward to seeing you there.

Jan 22 - 24 @Tokyo Big Sight, Japan

NEPCON JAPAN - January 22-24, 2025 at Tokyo

See you at 39th NEPCON JAPAN!

Dear Sirs,

We are planning to attend at SEMICON Japan 2024.
Let's discuss about our new technology there.

Dec 11 - 13 @Tokyo Big Sight, Japan

Home | SEMICON Japan

See you at SEMICON Japan 2024!

Dear Sirs,

We are planning to exhibit our new technology at CEATEC 2024.

Oct. 15-18 @Makuhari Messe, Japan

Our booth bumber is "8H522".

https://www.ceatec.com/en/

See you at CEATEC 2024!

Dear Sirs,

We are planning to exhibit our 3D LSI chip and wafers in the process at Kyushu Semiconductor Industry Exhibition.

We will also introduce the video of our ultra-high speed and high precision CtW stacking technology.

Sept 25-26 @Fukuoka, Japan

https://k-semi.jp/#sec9

 See you at Kyushu Semiconductor Industry Exhibition!

Dear Sirs,

We will exhibit our new technology at Leti Innobation Days 2024

June 25-27 @Grenoble, France

https://leti-innovation-days.com/2024/lid-world

Exhibition Jun. 25-27th 9:00~17:30 @ Partner's Corner, GROUND FLOOR, PALLADIUM, Grenoble

 See you at Leti Innovation Days !

June 12th-14th at Budapest, Hungary

Dear Sirs,

We will present "Fine Pitch Gold Cylinder Bump Bonding Technology" at WCSM 2024

June 12-14 @Budapest, Hungary

https://www.bitcongress.com/wcsm2024/index.asp

Seminar Jun. 14 10:35-10:55 @ Britannia Ⅰ, GF, Radisson Blu Beke Hotel, Budapest

 See you at WCSM !