T ohoku-MicroTec (T-Micro) was participating in 42nd INTERNEPCON JAPAN !!
Jan. 16-18, 2013 10:00-18:00 (10:00-17:00 on Jan. 18) , Tokyo Big Sight, Japan
We presented about (1)3D IC demo chips, (2) Several type of Barain microprobes for neuroscience, and (3) 3D IC manufacturing service.
We can make 3D stack chip using diced LSI chips. And 3D processing using 8"/12" LSI wafer and 12" Si interposer with high aspect ratio TSV (up to 10) will be availavle from this April.
