Tohoku Microtec Co., Ltd. (T-Micro) is pleased to announce that we will exhibit at SEMICON Southeast Asia 2026, to be held in Kuala Lumpur, Malaysia in May 2026.
Semicon Southeast Asia is an international exhibition that brings together key players from the semiconductor and electronics manufacturing supply chain, particularly across Southeast Asia.
In recent years, investment in semiconductor manufacturing, back-end processes, electronic components, equipment, and materials has been accelerating across the Southeast Asian region.
We look forward to meeting and speaking directly with visitors who are interested in 3D-IC, Advanced Packaging, and Wafer Processing Technologies in the dynamic atmosphere of the event.
At this year’s exhibition, T-Micro will present its technologies and services related to next-generation semiconductor packaging, including 3D-LSI technologies, at the NextGen Hub within the Innovation Booth.
We warmly invite you to visit our booth and attend our presentation during the event.
Exhibition Details
- Event : SEMICON Southeast Asia 2026
- Dates：May 5, 2026 - May 7, 2026
- Venue : Malaysia International Trade & Exhibition Centre (MITEC), Kuala Lumpur, Malaysia
- Booth No.：W1887
- ✅Note：Our booth will be located in the NextGen Hub within the Innovation Booth, Hall 1, 1F. Please feel free to stop by.
Presentation Information
- Date and Time：May 7, 2026, 11:40-11:55
- Venue : NextGen Hub Stage
- ✅Note：During the exhibition, T-Micro is scheduled to give a presentation at the NextGen Hub Stage.
Although the presentation will be brief, we will provide a clear overview of our technical fields and initiatives. We encourage visitors to attend the presentation during their visit to the exhibition.
Advance Consultation
To help make discussions on the day of the event more productive, we also welcome advance inquiries and consultation requests.
Please feel free to contact us through the form below.
Contact Form :
https://www.t-microtec.com/17749130183965
Examples of consultation topics:
- Contract wafer process services, including film deposition
- Prototype development for 3D/2.5D IC applications
Examples of Our Technologies
1️⃣ 3D/2.5D IC Technologies
…We will introduce high-density integration and stacking technologies for next-generation semiconductor packaging.
2️⃣ Contract Wafer Deposition Services
…We accept inquiries related to prototype development, process evaluation, and sample preparation for technical assessment, tailored to each customer’s specific technical challenges.
3️⃣ Hybrid Bonding
…Hybrid bonding is an increasingly important technology area as semiconductor devices continue to advance toward finer geometries and higher levels of integration.
Links
- Official Event Website : https://expo.semi.org/southeastasia2026/public/enter.aspx
- Tohoku Microtec Official Website : https://www.t-microtec.com/17617542344183
- Contact form : https://www.t-microtec.com/17749130183965
