2025 CEA-Leti Innovation Days / LID World Summit
Jun. 17-19 @Grenoble, France
Dear Sir/Madam,
Thank you very much to everyone who visited our booth at the LID World Summit.
If you have any questions about our technology or business model, please feel free to contact me.
[info.tm@t-microtec.com]
We would also like to express our sincere gratitude to the Leti staf for their kind support.
We look forward to seeing you again next year.
Best Regards,
Makoto Motoyoshi (CEO)
Dear Sirs,
We will exhibit at CEA-Leti Innovation Days / LID World Summit
June 17-19, 2025 @Grenoble, France
Visit partner's corner booth to see our new technology about 3D-LSI, please.
https://leti-innovation-days.com/2025/lid-world/partners-corner/
Exhibition Jun. 17-19th 9:30~16:30 @ Partner's Corner, GROUND FLOOR, PALLADIUM, Grenoble
See you at Leti Innovation Days !
Dear Sirs,
We are planning to attend at 39th NEPCON JAPAN.
Our products will be exhibited in the booth of SEIKA CORPORATION.
We are looking forward to seeing you there.
Jan 22 - 24 @Tokyo Big Sight, Japan
NEPCON JAPAN - January 22-24, 2025 at Tokyo
See you at 39th NEPCON JAPAN!
Dear Sirs,
We are planning to attend at SEMICON Japan 2024.
Let's discuss about our new technology there.
Dec 11 - 13 @Tokyo Big Sight, Japan
See you at SEMICON Japan 2024!
Dear Sirs,
We are planning to attend at The 6th International Conference on Machine Learning and Intelligent Systems (MLIS 2024).
Let's discuss about the technological advances in the field of machine learning and intelligent systems there.
Nov 17 - 20 @Kampar, Perak, Malaysia
See you at MLIS 2024!
2024 IEEE NSS MIC RTSD
Oct. 26th-Nov. 2nd @TAMPA, FLORIDA, USA
Dear Sir/Madam,
Thank you for visiting us at 2024 IEEE NSS MIC RTSD.
We presented our various 3D-ICs using elemental technologies such as TSV, stacking, micro bumping, etc.
In addition, our proprietary high-speed, high-precision chip positioning and micro bumping technologies were introduced.
Of course, we exhibited our 3D-IC Technology with samples at our booth.
If you need any further information, please feel free to contact us.
[info@t-microtec.com]
Best Regards,
Makoto Motoyoshi (CEO)
CEATEC 2024
Oct. 15th-18th @Makuhari Messe, Japan
Dear Sir/Madam,
Thank you for visiting us at CEATEC 2024.
We exhibited our 3D-IC Technology for the 5G era and AI chips at our booth.
If you need any further information, please feel free to contact us.
[info@t-microtec.com]
Best Regards,
Makoto Motoyoshi (CEO)
Dear Sirs,
We are planning to exhibit our new technology at 2024 IEEE NSS MIC RTSD.
Oct 26 - NOV 2 @TAMPA, FLORIDA, USA
See you at 2024 IEEE NSS MIC RTSD!
Dear Sirs,
We are planning to exhibit our new technology at CEATEC 2024.
Oct. 15-18 @Makuhari Messe, Japan
Our booth bumber is "8H522".
See you at CEATEC 2024!
Dear Sirs,
We are planning to exhibit our new technology at 3DIC 2024.
Sept 25-27 @Sendai, Japan
See you at IEEE International 3D Systems Integration Conference!
Dear Sirs,
We are planning to exhibit our 3D LSI chip and wafers in the process at Kyushu Semiconductor Industry Exhibition.
We will also introduce the video of our ultra-high speed and high precision CtW stacking technology.
Sept 25-26 @Fukuoka, Japan
See you at Kyushu Semiconductor Industry Exhibition!
2024 Leti Innovation Days
Jun. 25th-27th @Grenoble, France
Dear Sir/Madam,
Thank you for visiting us at 2024 Leti Innovation Days.
We exhibited our new technology. If you need any further information, please feel free to contact us.
[info@t-microtec.com]
This was our first time exhibiting at Leti Innovation Days, and we had a very meaningful time.
We were in an environment where exhibitors can directly develop business with each other in the period, and we were impressed by Leti's policy!
We would also like to thank Ms. Hélène (CEA-Leti), Ms. Kim, and the other Leti members for their thorough support. We would like to exhibit again.
See you again next year!
Makoto Motoyoshi (CEO)
2024 WCSM
Jun. 12th-14th @Budapest, Hungary
Dear Sirs,
Thank you for visiting us at 2024 WCSM.
We presented "Fine Pitch Gold Cylinder Bump Bomding Technology".
If you need any further information, please feel free to contact us.
[info@t-microtec.com]
Best regards,
Makoto Motoyoshi (CEO)
Dear Sirs,
We will exhibit our new technology at Leti Innobation Days 2024
June 25-27 @Grenoble, France
https://leti-innovation-days.com/2024/lid-world
Exhibition Jun. 25-27th 9:00~17:30 @ Partner's Corner, GROUND FLOOR, PALLADIUM, Grenoble
See you at Leti Innovation Days !
June 12th-14th at Budapest, Hungary
Dear Sirs,
We will present "Fine Pitch Gold Cylinder Bump Bonding Technology" at WCSM 2024
June 12-14 @Budapest, Hungary
https://www.bitcongress.com/wcsm2024/index.asp
Seminar Jun. 14 10:35-10:55 @ Britannia Ⅰ, GF, Radisson Blu Beke Hotel, Budapest
See you at WCSM !
January 15th-17th at Tokyo Big Sight
Dear Sirs,
Thank you for visiting us.
I really appreciate that we had informative and productive discussion with you.
If you need any information, please feel free to contact us.
(Info@t-microtec.com)
2019 Semicon Japan
Dec.11th-13th @ Tokyo Big Sight Japan
Dear Sirs,
Thank you for visiting us at 2019 SEMICON JAPAN.
If you need any further information, please do not hesitate in contact me.
[info@t-microtec.com]
Dear Sirs,
Thank you for visiting us at IEEE Nuclear Science Symposium & Medical Imaging Conference , Manchester.
We exhibited and presented our new micro-bump technology.
If you need any further information, please feel free to contact me at "info@t-microtec.com"
Best regards,
Makoto Motoyoshi (CEO)
Dec.15, 2018
Dear Sirs,
Thank you for visiting us at 2018 SEMICON JAPAN.
I really appreciated that I had many fruitful discussions with you.
If you need any further imformation, please do not hesitate in contact me at "info@t-microtec.com".
Best regards,
Makoto Motoyoshi (T-Micro/CEO)
Nov. 15, 2018
Dear Sirs,
Thank you for visiting us at IEEE NSS/MIC, Sydney.
We are so glad that you were interested in our 3D integration technology.
If you need any further information, please do not hesitate in contact me at "info@t-microtec.com".
Best regards,
Makoto Motoyoshi (T-Micro/CEO)
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