Thank you for visiting us @ 2024 IEEE NSS MIC RTSD

Tohoku-MicroTec（T-Micro）

東北マイクロテック株式会社

〒980-8579　宮城県仙台市青葉区荒巻字青葉６-６-40　T-Biz203

022-398-6264

E-mail：info@t-microtec.com

お問合せはこちら

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Thank you for visiting us @ 2024 IEEE NSS MIC RTSD

2024-11-01

2024 IEEE NSS MIC RTSD
Oct. 26th-Nov. 2nd @TAMPA, FLORIDA, USA

Dear Sir/Madam,

Thank you for visiting us at 2024 IEEE NSS MIC RTSD.

We presented our various 3D-ICs using elemental technologies such as TSV, stacking, micro bumping, etc.
In addition, our proprietary high-speed, high-precision chip positioning and micro bumping technologies were introduced.

Of course, we exhibited our 3D-IC Technology with samples at our booth.

If you need any further information, please feel free to contact us.
[info@t-microtec.com]

Best Regards,
Makoto Motoyoshi (CEO)

お問合せ・ご相談はこちら

お電話でのお問合せ・ご相談はこちら

022-398-6264

info@t-microtec.com

担当：元吉

お問合せはこちら

T-Micro is the unique and advanced 3D/2.5D IC process and MEMS process-oriented company, originated in Tohoku University.
As an exclusive technical representative of GINTI "Global Integration Initiative" facility, we provide worldwide customers with 3D/ 2.5D/ MEMS full foundry service as well as partial process service by use of a complete line of state-of-the-art 200 and 300mm equipment in a cost-effective and short-TAT way for R/D, prototype, and small volume production.

東北マイクロテック(T-Micro)は、最先端の積層型三次元IC(3D-IC)技術をベースにした会社で、微細TSV(貫通配線)、マイクロバンプ接合等の新技術を入れ、今後のIT需要の拡大に呼応して、従来のICチップに高性能・高機能・小型化・省電力化といった新しい機能を付加します。新規の積層型センサの開発と並行してお客様に以下のサービスを提供致します。