Tohoku Microtec Co., Ltd. will attend IEEE NSS/MIC/RTSD 2025 in Yokohama as visitors.
This international conference brings together researchers and industry to share the latest advances in nuclear science, medical imaging, and room-temperature semiconductor detectors.
The event will be held at Pacifico Yokohama North.
We will be on site to gather semiconductor-related information and engage with stakeholders.
If you would like to discuss our 3D-IC (3D LSI) capabilities during the event, please feel free to contact us in advance.
Event Overview
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Dates: November 1–8, 2025, 8:00–18:00 (JST)
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Venue: Pacifico Yokohama North
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Pre-event consultation: Contact Form – https://www.t-microtec.com/17581502428702
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Notes: We offer advanced packaging and micro-fabrication for 3D-IC (3D LSI), including micro-TSV and micro-bump, as well as contract manufacturing/prototyping and foundry services.
Links
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Official event information – IEEE NSS/MIC/RTSD 2025
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Tohoku Microtec: https://www.t-microtec.com/category/1420389.html
