Tohoku Microtec Co., Ltd. will exhibit at SEMICON Europa 2025 in Munich, GermanyーEurope's largest semiconductor event.
At our booth, we'll introduce our latest advances in 3D/2.5D-IC (3D-LSI) technologies.
Booth location : Hall C1, C1804ーupper-right area on the floor plan（marked with a red circle）.
Please stop by and say hello!
Exhibit Overview
- Dates : November 18(Tue) - November 21(Fri), 2025, 9:00-18:00
- Venue : Messe München(Munich, Germany)
- Booth : Hall C1, C1804
- Pre-event inquiry : Please contact us in advance via our contact form.
- ✅About T-Micro : We are a foundry specializing in advanced 3D-IC(3D-LSI) assembly, offering proprietary processes that enable integration from chip level up to 12-inch wafer level.
What You'll See at Our Booth
❶ TSV Technology ー customizable sizes and structures for diverse device requirements.
❷ Micro-Bump Technology ー fine-pitch interconnects for high-density, low-resistance connections.
❸ Proceessing Technology ー thinning, bonding, molding, and heterogeneous stacking to maximize 3D integration freedom.
Useful Links
Contact
Tel : +81-22-398-6264
Email : info.tm@t-microtec.com
We look forward to meeting you in Munich!
