Tohoku Microtec Co., Ltd. (T-Micro) will exhibit at the 40th NEPCON JAPAN - Electronics Development & Implementation Exhibition in Tokyo, Japan, in January 2026.
Tohoku Microtec is a wafer process foundry supporting advanced semiconductor process development and packaging. We provide end-to-end support from wafer process to assembly, with a strong focus on 3D-IC (3D LSI) technologies.
We look forward to meeting engineers and procurement professionals who are exploring practical solutions for advanced packaging, prototyping, and outsourced wafer process needs.
Booth Information
- Event : The 40th NEPCON JAPAN - Electronics Development & Implementation Exhibition
- Date/Hours : January 21 (Wed) - 23 (Fri), 2026 / 10:00-17:00
- Venue : Tokyo Big Sight (Tokyo, Japan)
- Booth : E18-32, Miyagi Prefecture Joint Exhibition Booth
- Note : The Miyagi joint booth is a collaborative initiative where local manufacturing companies showcase their technologies together. Please look for the "Tohoku MicroTec Co., Ltd." sign at the booth.
Pre-meeting (Recommended)
To make discussions at the show smoother, we strongly recommend arranging a brief pre-meeting in advance.
Prease submit the contact form here, and our team will get back to you :
https://www.t-microtec.com/17581502428702
What we can discuss
❶ Outsourcing wafer processes (including thin-film deposition)
❷ 3D-IC prototyping cunsultation
Our Technologies
❶ 3D-IC (3D LSI) packaging and assembly
❷ Contract wafer deposition services
❸ 12-inch wafer-ready thinning, bonding, molding, and heterogeneous material stacking/lamination
Links / Contact
- Event official : https://www.nepconjapan.jp/tokyo/en-gb.html#/
- Tohoku Microtec official : https://www.t-microtec.com/category/1420389.html
- Contact form : https://www.t-microtec.com/17581502428702
- Phone : +81-22-398-6264
- Email : info.tm@t-microtec.com
