We would like to express our sincere appreciation to everyone who visited the Tohoku-MicroTec Co., Ltd. (T-Micro) booth at CEA-Leti Innovation Days / LID World Summit 2026, held in Grenoble, France.
We would also like to thank everyone who attended the presentation delivered by our President, Makoto Motoyoshi, during the “Shaping What’s Next” session.
Throughout the event, we had valuable opportunities to exchange ideas with researchers, engineers, and industry professionals from around the world regarding our technologies and services, including:
- 3D-IC and 3D/2.5D IC technologies
- Fine-pitch interconnection using gold bumps
- Chip-level 3D integration
- Wafer processing services
- Prototype development and contract R&D support
We were delighted to introduce our technologies and services and to connect with so many people from across the global semiconductor and microelectronics community.
As a development-oriented foundry specializing in 3D-IC technologies, T-Micro will continue to enhance its technical capabilities and services to support advanced research and the realization of next-generation semiconductor technologies.
Thank you again for your interest and support.
For inquiries regarding our 3D-IC technologies, wafer processing, prototype development, or contract R&D services, please feel free to contact us through the inquiry form below.
Form : https://www.t-microtec.com/17581502428702
We look forward to seeing you again!
Links
- Event Official : LID World Summit 2026 - Partner events - Leti
- Tohoku Microtec Official : https://www.t-microtec.com/category/1420389.html
- Contact Form : https://www.t-microtec.com/17581502428702
