Tohoku Microtec Co., Ltd. (T-Micro) is delighted to announce its participation in SEMICON Taiwan 2026, taking place in Taipei, Taiwan, from September 2 to 4, 2026.
SEMICON Taiwan is an international exhibition connecting companies across the semiconductor supply chain, including equipment, materials, components, and inspection technologies.
The event offers opportunities to share technical developments, explore collaboration, and discuss business needs with industry professionals from around the world.
T-Micro will join the Miyagi Prefecture / Sendai City joint booth within the Japan Pavilion.
As a foundry focused on 3D-IC development and prototyping, we will showcase technologies and services supporting semiconductor research and advanced integration.
Our capabilities include processing customer-supplied IC chips and wafers up to 12 inches in diameter using through-silicon vias (TSVs), redistribution layers (RDLs), and bumping technologies.
We also support prototyping for silicon interposers, heterogeneous stacked devices, and chiplets.
Further information is available on our official exhibitor profile.
We welcome the opportunity to discuss your projects and technical challenges with engineers, researchers, and industry partners from Taiwan and beyond.
Visit us at Booth Q6134 to explore how T-Micro can support your development needs.
Exhibition Details
- Event : SEMICON Taiwan 2026
- Dates：September 2 (Wednesday)–September 4 (Friday), 2026
- Venue : Taipei Nangang Exhibition Center (TaiNEX 1 & 2), Taipei, Taiwan
- Exhibition Area：Japan Pavilion — Miyagi Prefecture / Sendai City Joint Booth
- Booth No.：Q6134
Advance Consultation
If you would like to discuss a specific project during the exhibition, we encourage you to contact us beforehand.
Sharing your technical requirements, development goals, and preferred meeting time will help us prepare for a productive conversation.
Contact Form :
https://www.t-microtec.com/17749130183965
Potential discussion topics include：
- Prototyping and development for 3D-IC and 2.5D IC applications
- Chip-level stacking and heterogeneous integration
- Contract processing for TSVs, RDLs, and bumps
- Fine-pitch bonding with gold micro-bumps
- Silicon interposer and chiplet prototyping
- Device prototypes and evaluation samples for R&D projects
Examples of Our Technologies
1️⃣ 3D-IC and 2.5D IC Technologies
We combine TSV, micro-bump, and redistribution technologies to support the development of high-density semiconductor integration and stacked devices.
2️⃣ Wafer Processing and Prototyping Services
Our services cover individual IC chips and wafers up to 12 inches in diameter. We welcome discussions about processing requirements for research, prototype fabrication, and evaluation.
3️⃣ Chip-Level 3D Integration
We support the stacking of customer-supplied IC chips, including prototyping projects involving heterogeneous devices and chiplets.
4️⃣ Fine-Pitch Gold Micro-Bump Interconnection
We will present our gold micro-bump bonding capabilities for closely spaced chip connections and discuss their application to heterogeneous device integration.
For more details, please visit our SEMICON Taiwan 2026 exhibitor profile.
Links
- Official Event Website : SEMICON Taiwan 2026 Official Website
- Related Exhibition：Japan Pavilion Information
- Tohoku Microtec Official Website : Home Page
- Contact form : Contact Form
We look forward to welcoming you to Booth Q6134 in Taipei!
