Tohoku Microtec Co., Ltd. (T-Micro) will participate in the 3rd Semiconductor Technology Expo in Kyushu, Japan, taking place at Marine Messe Fukuoka on September 30 and October 1, 2026.
The exhibition brings together technologies and services across the semiconductor supply chain, covering design, manufacturing equipment, components, materials, inspection, and measurement.
It provides opportunities for semiconductor companies and research institutions, particularly those in the Kyushu region, to exchange ideas, explore partnerships, and discuss business opportunities.
As a foundry supporting 3D-IC research and prototype development, T-Micro will showcase its processing and integration capabilities, including through-silicon vias (TSVs), redistribution layers (RDLs), and microbump bonding.
We welcome discussions on prototyping with customer-supplied IC chips and wafers, silicon interposers, heterogeneous device stacking, and other development challenges.
We look forward to discussing your projects and technical requirements with you. Please visit us at Booth B6-8 in Hall B!
Exhibition Details
- Event : The 3rd Semiconductor Technology Expo in Kyushu, Japan
- Dates：September 30 (Wednesday) – October 1 (Thursday), 2026
- Opening Hours：10:00–17:00 on both days
- Venue : Marine Messe Fukuoka, Halls A and B, Fukuoka, Japan
- T-Micro Exhibition Location：Hall B
- Booth No.：B6-8
- Admission：Free with advance visitor registration
Advance Consultation
If you have a prototype project in mind or a processing challenge you would like to discuss, we welcome inquiries before the exhibition.
Sharing your requirements and preferred meeting time in advance will help us prepare for a productive discussion at our booth.
Please send your inquiry through our Contact Form.
Topics we can discuss include：
- Prototyping for 3D-IC and 2.5D IC development
- Individual processing steps, including TSV fabrication, RDL formation, and bumping
- Chips stacking and heterogeneous integration using existing IC chips
- Fine-pitch chip-to-chip connections with gold microbumps
- Silicon interposer and chiplet-related prototyping
- Sample fabrication for materials and equipment evaluation
Technologies and Services on Display
1️⃣ 3D-IC and 2.5D IC Prototyping
We support the development of stacked devices and high-density packaging through TSV, RDL, and microbump technologies. Our services range from individual processing steps to prototype fabrication involving multiple integrated processes.
2️⃣ Contact Wafer and Chip Processing
Our processing capabilities cover IC chips measuring just a few millimeters on each side through to wafers up to 12 inches in diameter. We welcome inquiries involving deposition, photolithography, etching, chemical mechanical polishing (CMP), bonding, and chip assembly, tailored to your prototyping and evaluation needs.
3️⃣ Heterogeneous Integration and Chiplet Prototyping
We help customers combine devices with different functions and develop 3D structures using their own IC chips. We also welcome discussions on silicon interposers and chiplet-related prototypes, based on your intended device architecture and development objectives.
4️⃣ Gold Mcrobump Bonding
We will introduce gold microbump technologies for fine-pitch connections. Visit our booth to discuss bonding approaches for high-density sensor interconnections and stacked semiconductor devices.
For more details, please visit our SEMICON Taiwan 2026 exhibitor profile.
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