仙台市で三次元IC(3D-IC)技術なら
東北マイクロテック株式会社

Thsnk you for your visit @ NSREC 2018

IEEE Nuclear & Space Radiation Effects Conference

Jul.16-Jul.20 @ Waikoloa, HI, USA

 

Dear Sirs,

Thank you for visiting us.

We believe our 3D-IC technologies provide you the more reliable device structure.

If you have interest in 3D integration, please feel free to contact us (info@t-microtec.com).

Best regards,

 Makoto Motoyoshi

We Attend "SEMICON JAPAN 2017" (Dec. 13-15 @ Tokyo Big Sight)

Dear Sirs,

We will exhibit our new 3D technology at SEMICON JAPAN 2017.

December 13-15 @ Tokyo Big Sight

www.semiconjapan.org

Booth No. 1635 in Back-end & Overall Process Zone (Hall 1)

See you at Tokyo Big Sight

We attend "Semiconductor Packaging Symposium"

Nov 30, 2017. Conference & Exhibition
Semiconductor Packaging Symposium (MEPTEC)
~ Heterogenous integration, the road to implementation ~
Milpitas, CA
http://www.meptec.org/2017Q4/

We have a table booth.See you there!!

Thank you for your visiting us @2017NSS/MIC in Atlanta

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"3D Stacked Sensor/ Detector using u-Bump connection Technology" was presented at 2017 NSS/MIC (Nuclear Science Symposium & Medical Imaging Conference) in Atlanta during October 23-26.

www.nss-mic.org/2017/Welcome.asp

 

Thank you for visiting us.

Our "Self-Assembly" technology presented at Autotech council

We presented our "Self-Assembly" technology at Autotech council in Silicon valley on July 14.

Autotech council: http://www.autotechcouncil.com/

"Self-Assembly" is game-changing technology for throughput of Chip to Wafer bonding.

For more information:

info@t-mcirotec.com

Thank you for your visiting us @ Semicon Japan 2016

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December 14-16 @ Tokyo Big sight

www.semicon japan.org

Booth No. 1332 in Manufacturing Innovation Pavilion

Seminor Dec.16 12:40-13:30 @ Tech SPOT WEST

Thank you for visiting us.

We attend Semicon Japan 2016 (December 14-16 @ Tokyo Big sight)

Dear Sirs,

We will exhibit and present our new technology at Semicon Japan 2016

December 14-16 @ Tokyo Big sight

www.semicon japan.org

Booth No. 1332 in Manufacturing Innovation Pavilion

Seminor Dec.16 12:40-13:30 @ Tech SPOT WEST

 See you at Semicon Japan !

Thank you for your visiting us @ NSS/MIC, Strasbourg

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Nov. 03, 2016  

Dear Sirs,

Thank you for visiting us at IEEE NSS/MIC, Strasbourg.

We are so glad that you were interested in our technologies.

If you need any further information, please do not hesitate in contact me at "info@t-microtec.com".   

Best regards,

Makoto Motoyoshi  (T-Micro/CEO) 

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We attend 2016 NSS/MIC

October 29-November 06, 2016 Conference & Exhibition

2016 IEEE Nuclear Science Symposium & Medical Imaging Conference

Strasbourg, France

http://www.nss-mic.org/2016

We have a table booth (Exhibition period 11/1-3)

Also we present our micro-bump technology (11/2  17:00~@Schuman)

See you at 2016 MSS/MIC

We attend ICHEP2016 !!

August 3 -10, 2016 Conference & Exhibition
ICHEP2016
38th International Conference on High Energy Physics
Chicago, IL
We have a table booth (Exhibition 8/7-10)
https://www.ichep2016.org/
See you at ICHEP2016 !!

We attend SemiconWest 2016 !!

July 12-14, 2016. Conference & ExhibitionSemiconWest 2016  Booth No. 733
San Francisco, CA 
http://www.semiconwest.org/ 

See you at SemiconWest 2016 !!

We attend ECTC2016 !!

May 31-June 3, 2016. Conference & Exhibition
ECTC2016 (IEEE Electronic Components and Technology Conference), Booth No.219
Las Vegas, NV
http://ectc.net/

See you at ECTC2016!!

Thank you for visiting our booth at SemiconWest 2015 !!

Good meeting you at No 1232 in SemiconWest 2015 during July 14-16 !!

We announced our new patented Micro Au Cone Bump technology.

Technology: Micro Au-Cone Bump

Bump size: 2.5um x 2.5um

Bump Pitch: 5 um (Minimum)

Material: Au

Target Application: Sensors (Compound, X-Ray, SOI, etc)

For detailed information, please contact hasegawa@t-microtec.com (San Jose CA) 

We attend 3D-ASIP !!

T-Micro attends 3D-ASIP 2014 !!

3D Architectures for Semiconductor Integration and Packaginghttp://www.3dasip.org/

December 10-12, 2014Burlingame, CA

We have a table-booth, please join us !!

Event in November 2014!

Please visit our booth at the following conference & exhibition in November 2014 !!

Nov 15 - 19, 2014. Conference & ExhibitionNeuroscience 2014

Booth No. 1913Washington D.C.
http://www.sfn.org/annual-meeting/neuroscience-2014

T-Micro presents Omni-directional Brain probe for Deep brain recording & Stimulation !

 

Nov 12 - 13, 2014. Conference
T Sensors Summit for Trillion Sensor Roadmap
San Diego CA

http://www.tsensorssummit.org/

T-Micro presents 3D-IC/Si Interposer/MEMS foundry service by GINTI's 200/300mm wafer process line.

 

Thank you for Visiting GINTI/T-Micro Booth at SemiconJapan 2013

Thank you so much for visiting T-Micro and GINTI (Global Integration Initiative: http://www.ginti.niche.tohoku.ac.jp ) booth at Semicon Japan 2013 ! 

(Semicon Japan ) http://www.semiconjapan.org
Dec.4-Dec.6, 2013
Makuhari Messe, Chiba, Japan

Booth: Hall 1, D1-003

Professor. Koyanagi and T-Mciro CEO Ph.D Motoyoshi make a presentation of T-Micro/GINTI's 2.5/3D IC process service by a complete line of 200/300mm equipment and our new and cost-effective protptype making methodology by Chio-on-Wafer using conventional/customized 2D chip dies at TechSTAGE EAST

Dec. 4  12:30~12:50 
Dec. 5  12:00~12:20 (Release Presentation)
Location:

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Thank you for visiting T-micro/GINTI booth at IEEE 3D Integration Conference 2013

Thank you for visiting T-micro/GINTI booth at IEEE International 3D Integration Conference 2013 in San Francisco, CA, USA on Oct 2-4, 2013.

T-micro/GINTI team exhibited the brand-new "Global Integration Initiative" activity, which is 3D/2.5D IC process service with a complete line of 200 and 300mm equipments as one stop-service of TSV design, mfg, pkg and test for R/D, prototype, and small volume production.

3DIC conf 2013 booth

GINITI specilizes Wafer on Wafer, Chip on Chip as well as Chip on Wafer, which stack multiple layers of a variety of 2D conventional KGDs (Known Good Die) on a support wafer.

More details of GINTI. Please click here !

T ohoku-MicroTec (T-Micro) was participating in 42nd INTERNEPCON JAPAN !!

Jan. 16-18, 2013  10:00-18:00 (10:00-17:00 on Jan. 18)    , Tokyo Big Sight, Japan

http://www.nepcon.jp/en/To-Exhibit/

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We presented about (1)3D IC demo chips, (2) Several type of Barain microprobes for neuroscience, and (3) 3D IC manufacturing service.

We can make 3D stack chip using diced LSI chips. And 3D processing using 8"/12" LSI wafer and 12" Si interposer with high aspect ratio TSV (up to 10) will be availavle from this April.

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お問合せ・ご相談はこちら

お電話でのお問合せ・ご相談はこちら
022-398-6264

担当:元吉

T-Micro is the unique and advanced 3D/2.5D IC process and MEMS process-oriented company, originated in Tohoku University.
As an exclusive technical representative of GINTI "Global Integration Initiative" facility, we provide worldwide customers with 3D/ 2.5D/ MEMS full foundry service as well as partial process service by use of a complete line of state-of-the-art 200 and 300mm equipment in a cost-effective and short-TAT way for R/D, prototype, and small volume production.

東北マイクロテック(T-Micro)は、最先端の積層型三次元IC(3D-IC)技術をベースにした会社で、微細TSV(貫通配線)、マイクロバンプ接合等の新技術を入れ、今後のIT需要の拡大に呼応して、従来のICチップに高性能・高機能・小型化・省電力化といった新しい機能を付加します。新規の積層型センサの開発と並行してお客様に以下のサービスを提供致します。

  1. 数㎜角のチップから12インチウェハレベルの加工が可能で、お客様の3D-ICやMEMSのプロトタイプ試作、部分試作サポート、材料・装置評価用サンプル試作、少量生産をサポートします。
  2. 半導体微細加工技術及びMEMS製造技術をベースにバイオエレクトロニックデバイスの試作をサポートします。

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