〒980-8579 宮城県仙台市青葉区荒巻字青葉６-６-40 T-Biz203
IEEE Nuclear & Space Radiation Effects Conference
Jul.16-Jul.20 @ Waikoloa, HI, USA
Dear Sirs,
Thank you for visiting us.
We believe our 3D-IC technologies provide you the more reliable device structure.
If you have interest in 3D integration, please feel free to contact us (info@t-microtec.com).
Best regards,
Makoto Motoyoshi
Dear Sirs,
We will exhibit our new 3D technology at SEMICON JAPAN 2017.
December 13-15 @ Tokyo Big Sight
Booth No. 1635 in Back-end & Overall Process Zone (Hall 1)
See you at Tokyo Big Sight
Nov 30, 2017. Conference & Exhibition
Semiconductor Packaging Symposium (MEPTEC)
~ Heterogenous integration, the road to implementation ~
Milpitas, CA
http://www.meptec.org/2017Q4/
We have a table booth.See you there!!
"3D Stacked Sensor/ Detector using u-Bump connection Technology" was presented at 2017 NSS/MIC (Nuclear Science Symposium & Medical Imaging Conference) in Atlanta during October 23-26.
www.nss-mic.org/2017/Welcome.asp
Thank you for visiting us.
We presented our "Self-Assembly" technology at Autotech council in Silicon valley on July 14.
Autotech council: http://www.autotechcouncil.com/
"Self-Assembly" is game-changing technology for throughput of Chip to Wafer bonding.
For more information:
December 14-16 @ Tokyo Big sight
Booth No. 1332 in Manufacturing Innovation Pavilion
Seminor Dec.16 12:40-13:30 @ Tech SPOT WEST
Thank you for visiting us.
Dear Sirs,
We will exhibit and present our new technology at Semicon Japan 2016
December 14-16 @ Tokyo Big sight
Booth No. 1332 in Manufacturing Innovation Pavilion
Seminor Dec.16 12:40-13:30 @ Tech SPOT WEST
See you at Semicon Japan !
Nov. 03, 2016
Dear Sirs,
Thank you for visiting us at IEEE NSS/MIC, Strasbourg.
We are so glad that you were interested in our technologies.
If you need any further information, please do not hesitate in contact me at "info@t-microtec.com".
Best regards,
Makoto Motoyoshi (T-Micro/CEO)
October 29-November 06, 2016 Conference & Exhibition
2016 IEEE Nuclear Science Symposium & Medical Imaging Conference
Strasbourg, France
We have a table booth (Exhibition period 11/1-3)
Also we present our micro-bump technology (11/2 17:00~@Schuman)
See you at 2016 MSS/MIC
August 3 -10, 2016 Conference & Exhibition
ICHEP2016
38th International Conference on High Energy Physics
Chicago, IL
We have a table booth (Exhibition 8/7-10)
https://www.ichep2016.org/
See you at ICHEP2016 !!
July 12-14, 2016. Conference & ExhibitionSemiconWest 2016 Booth No. 733
San Francisco, CA
http://www.semiconwest.org/
May 31-June 3, 2016. Conference & Exhibition
ECTC2016 (IEEE Electronic Components and Technology Conference), Booth No.219
Las Vegas, NV
http://ectc.net/
See you at ECTC2016!!
Good meeting you at No 1232 in SemiconWest 2015 during July 14-16 !!
We announced our new patented Micro Au Cone Bump technology.
Technology: Micro Au-Cone Bump
Bump size: 2.5um x 2.5um
Bump Pitch: 5 um (Minimum)
Material: Au
Target Application: Sensors (Compound, X-Ray, SOI, etc)
For detailed information, please contact hasegawa@t-microtec.com (San Jose CA)
T-Micro attends 3D-ASIP 2014 !!
3D Architectures for Semiconductor Integration and Packaginghttp://www.3dasip.org/
December 10-12, 2014Burlingame, CA
We have a table-booth, please join us !!
Please visit our booth at the following conference & exhibition in November 2014 !!
Nov 15 - 19, 2014. Conference & ExhibitionNeuroscience 2014
Booth No. 1913Washington D.C.
http://www.sfn.org/annual-meeting/neuroscience-2014
T-Micro presents Omni-directional Brain probe for Deep brain recording & Stimulation !
Nov 12 - 13, 2014. Conference
T Sensors Summit for Trillion Sensor Roadmap
San Diego CA
http://www.tsensorssummit.org/
T-Micro presents 3D-IC/Si Interposer/MEMS foundry service by GINTI's 200/300mm wafer process line.
Thank you so much for visiting T-Micro and GINTI (Global Integration Initiative: http://www.ginti.niche.tohoku.ac.jp ) booth at Semicon Japan 2013 !
(Semicon Japan ) http://www.semiconjapan.org
Dec.4-Dec.6, 2013
Makuhari Messe, Chiba, Japan
Booth: Hall 1, D1-003
Dec. 4 12:30~12:50
Dec. 5 12:00~12:20 (Release Presentation)
Location:
Thank you for visiting T-micro/GINTI booth at IEEE International 3D Integration Conference 2013 in San Francisco, CA, USA on Oct 2-4, 2013.
T-micro/GINTI team exhibited the brand-new "Global Integration Initiative" activity, which is 3D/2.5D IC process service with a complete line of 200 and 300mm equipments as one stop-service of TSV design, mfg, pkg and test for R/D, prototype, and small volume production.
GINITI specilizes Wafer on Wafer, Chip on Chip as well as Chip on Wafer, which stack multiple layers of a variety of 2D conventional KGDs (Known Good Die) on a support wafer.
More details of GINTI. Please click here !
T ohoku-MicroTec (T-Micro) was participating in 42nd INTERNEPCON JAPAN !!
Jan. 16-18, 2013 10:00-18:00 (10:00-17:00 on Jan. 18) , Tokyo Big Sight, Japan
We presented about (1)3D IC demo chips, (2) Several type of Barain microprobes for neuroscience, and (3) 3D IC manufacturing service.
We can make 3D stack chip using diced LSI chips. And 3D processing using 8"/12" LSI wafer and 12" Si interposer with high aspect ratio TSV (up to 10) will be availavle from this April.
Oct 10, 2012 : Press-Release
Tohoku-MicroTec Co., Ltd. forges strategic alliance with Microprobes for Life Sciences (Gaithersburg, MD, USA) to offer multichannel silicion nerual interfaces.
Tohoku-MicroTec attend Neuroscience2012 !!
See you at our booth in Neuroscience2012.
Oct 13 - 17, 2012
Ernest N. Morial Convention Center, New Orleans
Booth: 1735
担当：元吉
T-Micro is the unique and advanced 3D/2.5D IC process and MEMS process-oriented company, originated in Tohoku University.
As an exclusive technical representative of GINTI "Global Integration Initiative" facility, we provide worldwide customers with 3D/ 2.5D/ MEMS full foundry service as well as partial process service by use of a complete line of state-of-the-art 200 and 300mm equipment in a cost-effective and short-TAT way for R/D, prototype, and small volume production.
東北マイクロテック(T-Micro)は、最先端の積層型三次元IC(3D-IC)技術をベースにした会社で、微細TSV(貫通配線)、マイクロバンプ接合等の新技術を入れ、今後のIT需要の拡大に呼応して、従来のICチップに高性能・高機能・小型化・省電力化といった新しい機能を付加します。新規の積層型センサの開発と並行してお客様に以下のサービスを提供致します。
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