Dear Sirs,

We will exhibit our new 3D technology at SEMICON JAPAN 2017.

December 13-15 @ Tokyo Big Sight

www.semiconjapan.org

Booth No. 1635 in Back-end & Overall Process Zone (Hall 1)

See you at Tokyo Big Sight

Nov 30, 2017. Conference & Exhibition
Semiconductor Packaging Symposium (MEPTEC)
~ Heterogenous integration, the road to implementation ~
Milpitas, CA
http://www.meptec.org/2017Q4/

We have a table booth.See you there!!

Dear Sirs,

We will exhibit and present our new technology at Semicon Japan 2016

December 14-16 @ Tokyo Big sight

www.semicon japan.org

Booth No. 1332 in Manufacturing Innovation Pavilion

Seminor Dec.16 12:40-13:30 @ Tech SPOT WEST

 See you at Semicon Japan !

October 29-November 06, 2016 Conference & Exhibition

2016 IEEE Nuclear Science Symposium & Medical Imaging Conference

Strasbourg, France

http://www.nss-mic.org/2016

We have a table booth (Exhibition period 11/1-3)

Also we present our micro-bump technology (11/2  17:00~@Schuman)

See you at 2016 MSS/MIC

August 3 -10, 2016 Conference & Exhibition
ICHEP2016
38th International Conference on High Energy Physics
Chicago, IL
We have a table booth (Exhibition 8/7-10)
https://www.ichep2016.org/
See you at ICHEP2016 !!

July 12-14, 2016. Conference & ExhibitionSemiconWest 2016  Booth No. 733
San Francisco, CA 
http://www.semiconwest.org/ 

May 31-June 3, 2016. Conference & Exhibition
ECTC2016 (IEEE Electronic Components and Technology Conference), Booth No.219
Las Vegas, NV
http://ectc.net/

See you at ECTC2016!!

Good meeting you at No 1232 in SemiconWest 2015 during July 14-16 !!

We announced our new patented Micro Au Cone Bump technology.

Technology: Micro Au-Cone Bump

Bump size: 2.5um x 2.5um

Bump Pitch: 5 um (Minimum)

Material: Au

Target Application: Sensors (Compound, X-Ray, SOI, etc)

For detailed information, please contact hasegawa@t-microtec.com (San Jose CA) 

T-Micro attends 3D-ASIP 2014 !!

3D Architectures for Semiconductor Integration and Packaginghttp://www.3dasip.org/

December 10-12, 2014Burlingame, CA

We have a table-booth, please join us !!

Please visit our booth at the following conference & exhibition in November 2014 !!

Nov 15 - 19, 2014. Conference & ExhibitionNeuroscience 2014

Booth No. 1913Washington D.C.
http://www.sfn.org/annual-meeting/neuroscience-2014

T-Micro presents Omni-directional Brain probe for Deep brain recording & Stimulation !

Nov 12 - 13, 2014. Conference
T Sensors Summit for Trillion Sensor Roadmap
San Diego CA
http://www.tsensorssummit.org/

T-Micro presents 3D-IC/Si Interposer/MEMS foundry service by GINTI's 200/300mm wafer process line.

Thank you so much for visiting T-Micro and GINTI (Global Integration Initiative: http://www.ginti.niche.tohoku.ac.jp ) booth at Semicon Japan 2013 ! 

(Semicon Japan ) http://www.semiconjapan.org
Dec.4-Dec.6, 2013
Makuhari Messe, Chiba, Japan
Booth: Hall 1, D1-003

Dec. 4  12:30~12:50 
Dec. 5  12:00~12:20 (Release Presentation)
Location:

Thank you for visiting T-micro/GINTI booth at IEEE International 3D Integration Conference 2013 in San Francisco, CA, USA on Oct 2-4, 2013.

T-micro/GINTI team exhibited the brand-new "Global Integration Initiative" activity, which is 3D/2.5D IC process service with a complete line of 200 and 300mm equipments as one stop-service of TSV design, mfg, pkg and test for R/D, prototype, and small volume production.

GINITI specilizes Wafer on Wafer, Chip on Chip as well as Chip on Wafer, which stack multiple layers of a variety of 2D conventional KGDs (Known Good Die) on a support wafer.

More details of GINTI. Please click here !

T ohoku-MicroTec (T-Micro) was participating in 42nd INTERNEPCON JAPAN !!

Jan. 16-18, 2013  10:00-18:00 (10:00-17:00 on Jan. 18)    , Tokyo Big Sight, Japan

http://www.nepcon.jp/en/To-Exhibit/

We presented about (1)3D IC demo chips, (2) Several type of Barain microprobes for neuroscience, and (3) 3D IC manufacturing service.

We can make 3D stack chip using diced LSI chips. And 3D processing using 8"/12" LSI wafer and 12" Si interposer with high aspect ratio TSV (up to 10) will be availavle from this April.